Plating apparatus
US-12571120-B2 · Mar 10, 2026 · US
Electroplating using magnetic fields, e.g. magnets
Electroplating using magnetic fields, e.g. magnets · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D5/007 |
| Official title | {Electroplating using magnetic fields, e.g. magnets} |
| Display label | Electroplating using magnetic fields, e.g. magnets |
| Total patents | 33 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2017 | 4 |
| 2018 | 1 |
| 2019 | 1 |
| 2020 | 4 |
| 2021 | 4 |
| 2022 | 3 |
| 2023 | 8 |
| 2024 | 4 |
| 2025 | 1 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electroplating device and method for manufacturing plated product
US-12351930-B2 · Jul 8, 2025 · US
Systems and methods for shielding features of a workpiece during electrochemical deposition
US-11987897-B2 · May 21, 2024 · US
Method for manufacturing a package
US-11913132-B2 · Feb 27, 2024 · US
Plating apparatus and film thickness measuring method for substrate
US-11906299-B2 · Feb 20, 2024 · US
Electroplating apparatus and electroplating method
US-11859302-B2 · Jan 2, 2024 · US
Method for manufacturing a package
US-2023374689-A1 · Nov 23, 2023 · US
Electroplating apparatus and electroplating method
US-11686008-B2 · Jun 27, 2023 · US
Apparatus and method for manufacturing of steel and other support material structures with carbon capture capability and high efficiency
US-2023167567-A1 · Jun 1, 2023 · US
Plating apparatus and film thickness measuring method for substrate
US-2023152077-A1 · May 18, 2023 · US
Electroplating apparatus and electroplating method
US-2023124913-A1 · Apr 20, 2023 · US
Electroplating apparatus and electroplating method
US-2023124732-A1 · Apr 20, 2023 · US
Plating apparatus
US-2023096305-A1 · Mar 30, 2023 · US
Methods of fabricating stacked magnetic cores having small footprints
US-11594370-B1 · Feb 28, 2023 · US
Electroplating device and method for manufacturing plated product
US-2022411951-A1 · Dec 29, 2022 · US
Electroplating method
US-11236431-B2 · Feb 1, 2022 · US
Magnetic structure for metal plating control
US-11230791-B2 · Jan 25, 2022 · US
Plated material and manufacturing method therefor
US-11072866-B2 · Jul 27, 2021 · US
Preparation method of miniature intelligent calcium alginate hydrogel end operator
US-2021222310-A1 · Jul 22, 2021 · US
Nanocomposite magnetic materials for magnetic devices and systems
US-11062826-B2 · Jul 13, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D5/007?
- CPC C25D5/007 is the Cooperative Patent Classification code for “Electroplating using magnetic fields, e.g. magnets.”
- How many patents are filed under CPC C25D5/007 (Electroplating using magnetic fields, e.g. magnets)?
- Our database includes 33 publications tagged with this CPC code.
- Is patent activity under CPC C25D5/007 growing?
- Publication counts under this code: 4 in 2024 vs 1 in 2025 (latest complete years).