Methods of fabricating stacked magnetic cores having small footprints

Patent metadata

Field	Value
Publication number	US-11594370-B1
Application number	US-202217807563-A
Country	US
Kind code	B1
Filing date	Jun 17, 2022
Priority date	Jun 17, 2022
Publication date	Feb 28, 2023
Grant date	Feb 28, 2023

Abstract

Stacked magnetic cores that can achieve high density with a small footprint, as well as methods of fabricating and using the same, are provided. A stacked magnetic core can be fabricated by depositing nanomagnetic films with control in composition and nanostructure via a continuous electroplating process. The magnetic films are interspersed with thin adhesive films (that can be insulating) in an automated roll-to-roll process. That is, the magnetic films and adhesive films are disposed in an alternating fashion. The adhesive films can keep the magnetic films completely electrically isolated from each other, while also adhering adjacent magnetic films to each other.

First claim

What is claimed is:

1. A method of fabricating a stacked magnetic core for an electrical component, the method comprising:
performing an electroplating process under a magnetic field to form a first magnetic film on a plating carrier substrate;
forming a first adhesive film on an upper surface of the first magnetic film;
performing the electroplating process under the magnetic field to form a second magnetic film on the plating carrier substrate;
forming a second adhesive film on an upper surface of the second magnetic film;
removing the first magnetic film with the first adhesive film thereon from the plating carrier substrate and disposing it on an interim substrate; and
removing the second magnetic film with the second adhesive film thereon from the plating carrier substrate and disposing it on the first adhesive film, forming the stacked magnetic core comprising the first magnetic film, the first adhesive film on the first magnetic film, the second magnetic film on the first adhesive film, and the second adhesive film on the second magnetic film,
the first magnetic film being electrically insulated from the second magnetic film by the first adhesive film,
the performing of the electroplating process comprising performing the electroplating process in an electroplating bath having a rectangular frame disposed around the electroplating bath,
the rectangular frame comprising a first side, a second side perpendicular to the first side, a third side parallel to the first side, and a fourth side parallel to the second side,
each of the first side and the third side being longer than each of the second side and the fourth side,
the first side comprising a first hard magnet,
the second side comprising a first soft magnet,
the third side comprising a second hard magnet,
the fourth side comprising a second soft magnet.

2. The method according to claim 1 , further comprising removing the first magnetic film, the first adhesive film, the second magnetic film, and the second adhesive film from the interim substrate.

3. The method according to claim 1 , a footprint of the stacked magnetic core being 10 mm 2 or less.

4. The method according to claim 1 , the stacked magnetic core being configured to be used in an inductor having an inductance density of at least 5 nanohenries per square millimeter (nH/mm 2 ).

5. The method according to claim 1 , the stacked magnetic core having a coercivity of no more than 1 Oersted (Oe).

6. The method according to claim 1 , the first magnetic film and the second magnetic film each being an alloy of nickel, iron, and optionally cobalt.

7. The method according to claim 1 , a thickness of the first adhesive film, measured in a first direction perpendicular to the upper surface of the first magnetic film, being in a range of from 0.05 micrometers (μm) to 5 μm, and
a thickness of the second adhesive film, measured in the first direction, being in a range of from 0.05 μm to 5 μm.

8. The method according to claim 7 , the thickness of the first adhesive film, being in a range of from 0.1 μm to 1 μm, and
the thickness of the second adhesive film, being in a range of from 0.1 μm to 1 μm.

9. The method according to claim 1 , a thickness of the first magnetic film, measured in a first direction perpendicular to the upper surface of the first magnetic film, being in a range of from 0.05 μm to 5 μm, and
a thickness of the second magnetic film, measured in the first direction, being in a range of from 0.05 μm to 5 μm.

10. The method according to claim 9 , the thickness of the first magnetic film, being in a range of from 0.5 μm to 2 μm, and
the thickness of the second magnetic film, being in a range of from 0.5 μm to 2 μm.

11. The method according to claim 1 , the first hard magnet and the second hard magnet being disposed such that they have a same North-South orientation as each other.

12. The method according to claim 1 , each of the first soft magnet and the second soft magnet being a soft stainless steel magnet.

13. The method according to claim 1 , the removing of the first magnetic film with the first adhesive film thereon from the plating carrier substrate and disposing it on an interim substrate being performed before the performing of the electroplating process to form the second magnetic film on the plating carrier substrate.

14. The method according to claim 1 , the performing of the electroplating process comprising disposing a mask on the plating carrier substrate before forming the first magnetic film and before forming the second magnetic film, such that the respective magnetic film is formed on the plating carrier substrate only where the mask is absent, and
the method further comprising removing the mask before removing first magnetic film from the plating carrier substrate and removing the mask before removing second magnetic film from the plating carrier substrate.

15. A method of fabricating a stacked magnetic core for an electrical component, the method comprising:
a) forming a plurality of magnetic film-insulating film pairs, each magnetic film-adhesive film pair comprising an adhesive film disposed on an upper surface of a magnetic film, on a plating carrier substrate by performing an electroplating process under a magnetic field to form the respective magnetic film on the plating carrier substrate and then forming the respective adhesive film on an upper surface of the magnetic film;
b) removing each magnetic film-adhesive film pair on its own, independently of the other magnetic film-adhesive film pairs; and
c) disposing each magnetic film-adhesive film pair on an interim substrate to form the stacked magnetic core comprising a stacked structure of the plurality of magnetic film-adhesive film pairs,
the magnetic film of each magnetic film-adhesive film pair being electrically insulated from the magnetic film of each other magnetic film-adhesive film pair by its adhesive film and the adhesive film of the magnetic film-adhesive film pair with which it is in direct contact,
a footprint of the stacked magnetic core, measured in a first plane having the upper surface of the magnetic film of each magnetic film-adhesive film pair, being 10 square millimeters (mm 2 ) or less,
steps a), b), and c) being performed in an automated, roll-to-roll process,
the performing of the electroplating process in step a) comprising performing the electroplating process in an electroplating bath having a rectangular frame disposed around the electroplating bath,
the rectangular frame comprising a first side, a second side perpendicular to the first side, a third side parallel to the first side, and a fourth side parallel to the second side,
each of the first side and the third side being longer than each of the second side and the fourth side,
the first side comprising a first hard magnet,
the second side comprising a first soft magnet,
the third side comprising a second hard magnet,
the fourth side comprising a second soft magnet,
the first hard magnet and the second hard magnet being disposed such that they have a same North-South orientation as each other.

16. The method according to claim 15 , further comprising removing the plurality of magnetic film-adhesive film pairs from the interim substrate,
a thickness of the adhesive film of each magnetic film-adhesive film pair, measured in a first direction perpendicular to the upper surface of the magnetic film of the magnetic film-adhesive film pair, being in a range of from 0.05 micrometers (μm) to 5 μm, and
a thickness of the magnetic film of each magnetic film-adhesive film pair, measured

Assignees

• Pulugurtha Markondeyaraj
• Cercado Carlos Riera
• Gomez Juan Camilo
• Jaiswal Veeru
• The Florida International Univ Board Of Trustees

Inventors

• Pulugurtha Markondeyaraj
• Cercado Carlos Riera
• Gomez Juan Camilo
• Jaiswal Veeru

Classifications

• H01F41/26

  using electric currents {, e.g. electroplating} · CPC title

• H01F41/046 Primary

  structurally combined with ferromagnetic material · CPC title

• H01F10/26

  characterised by the substrate or intermediate layers {(H01F10/06 and H01F10/32 take precedence)} · CPC title

• C25D7/001

  Magnets · CPC title

• C25D5/022

  using masking means · CPC title