Plating apparatus and film thickness measuring method for substrate

Patent metadata

Field	Value
Publication number	US-11906299-B2
Application number	US-202117616906-A
Country	US
Kind code	B2
Filing date	Jan 20, 2021
Priority date	Jan 20, 2021
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

Provided is a technique that allows measuring a film thickness of a substrate in a plating process.A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.

First claim

The invention claimed is:

1. A plating apparatus comprising:
a plating tank configured to store a plating solution and internally including an anode;
a substrate holder disposed above the anode and configured to hold a substrate as a cathode;
a rotation mechanism configured such that the rotation mechanism rotates the substrate holder when a plating process is performed on the substrate;
a plurality of contact members disposed in the substrate holder and arranged in a circumferential direction of the substrate holder, the plurality of contact members being configured to contact an outer peripheral edge of a lower surface of the substrate to supply electricity to the substrate in the plating process;
a coil configured to generate a current by an electromagnetic induction due to a magnetic field caused by a current flowing into a contact member of the plurality of contact members, the plurality of contact members being configured to rotate together with the substrate holder in the plating process;
a current sensor configured to detect the current generated in the coil; and
a film thickness measuring device configured to measure a film thickness of the substrate based on the current detected by the current sensor in the plating process.

2. The plating apparatus according to claim 1 , wherein
the coil is disposed to have a space from the substrate holder outside the substrate holder in a radial direction of the substrate holder.

3. The plating apparatus according to claim 1 , wherein
the plurality of contact members are disposed equally in the circumferential direction of the substrate holder; and
the current sensor is configured to detect a current generated in the coil by the electromagnetic induction due to the magnetic field caused by the contact member that has most closely approached the coil, among the plurality of contact members configured to rotate together with the substrate holder in the plating process.

4. A film thickness measuring method for substrate using a plating apparatus, wherein the plating apparatus includes:
a plating tank configured to store a plating solution and internally including an anode;
a substrate holder disposed above the anode and configured to hold a substrate as a cathode;
a rotation mechanism configured such that the rotation mechanism rotates the substrate holder when performing a plating process on the substrate;
a plurality of contact members disposed in the substrate holder and arranged in a circumferential direction of the substrate holder, the plurality of contact members being configured to contact an outer peripheral edge of a lower surface of the substrate to supply electricity to the substrate in the plating process; and
a coil configured to generate a current by an electromagnetic induction due to a magnetic field caused by a current flowing into a contact member of the plurality of contact members, the plurality of contact members being configured to rotate together with the substrate holder in the plating process, wherein
the film thickness measuring method comprises:
detecting the current generated in the coil in the plating process; and
measuring a film thickness of the substrate based on the detected current.

Assignees

• Ebara Corp

Inventors

• Seki Masaya
• Tomita Masaki
• Chang Shao Hua

Classifications

• G01B7/06 Primary

  for measuring thickness {(measuring during the manufacture of coatings C23C14/54)} · CPC title

• C25D5/007

  Electroplating using magnetic fields, e.g. magnets · CPC title

• C25D17/005

  Contacting devices · CPC title

• C25D17/02

  Tanks; Installations therefor · CPC title

• C25D17/10

  Electrodes {, e.g. composition, counter electrode} · CPC title