Chemical Mechanical Polishing For Copper And Through Silicon Via Applications
US-2020277514-A1 · Sep 3, 2020 · US
Heavy metals
Heavy metals · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23F3/04 |
| Official title | Heavy metals |
| Display label | Heavy metals |
| Total patents | 97 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 11 |
| 2017 | 18 |
| 2018 | 10 |
| 2019 | 9 |
| 2020 | 16 |
| 2021 | 9 |
| 2022 | 2 |
| 2023 | 9 |
| 2024 | 2 |
| 2025 | 2 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Chemical mechanical polishing (CMP) of cobalt-containing substrate
US-10745589-B2 · Aug 18, 2020 · US
Slurry composition for polishing tungsten barrier layer
US-2020157382-A1 · May 21, 2020 · US
Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias
US-10640874-B2 · May 5, 2020 · US
Slurry and manufacturing semiconductor using the slurry
US-2020135486-A1 · Apr 30, 2020 · US
Neutral to alkaline chemical mechanical polishing compositions and methods for tungsten
US-2020010726-A1 · Jan 9, 2020 · US
Slurries for chemical mechanical polishing of cobalt containing substrates
US-2019292405-A1 · Sep 26, 2019 · US
Elevated temperature CMP compositions and methods for use thereof
US-10364373-B2 · Jul 30, 2019 · US
Laminate for see-through electrodes, see-through electrode material, device and method for producing laminate for see-through electrodes
US-2019187841-A1 · Jun 20, 2019 · US
CMP polishing agent, manufacturing method thereof, and method for polishing substrate
US-10297461-B2 · May 21, 2019 · US
Anti-corrosion polishing composition
US-2019112504-A1 · Apr 18, 2019 · US
Copper plasma etching method and manufacturing method of display panel
US-2019103287-A1 · Apr 4, 2019 · US
Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias
US-2019048472-A1 · Feb 14, 2019 · US
Chemical mechanical polishing method for tungsten
US-2019051537-A1 · Feb 14, 2019 · US
Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives
US-10181408-B2 · Jan 15, 2019 · US
CMP slurry composition for polishing copper and polishing method using the same
US-10150890-B2 · Dec 11, 2018 · US
Corrosion inhibitors and related compositions and methods
US-10124464-B2 · Nov 13, 2018 · US
CMP slurry composition for metal wiring and polishing method using the same
US-10100225-B2 · Oct 16, 2018 · US
Polishing composition
US-10059860-B2 · Aug 28, 2018 · US
Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives
US-2018218918-A1 · Aug 2, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23F3/04?
- CPC C23F3/04 is the Cooperative Patent Classification code for “Heavy metals.”
- How many patents are filed under CPC C23F3/04 (Heavy metals)?
- Our database includes 97 publications tagged with this CPC code.
- Is patent activity under CPC C23F3/04 growing?
- Publication counts under this code: 2 in 2024 vs 2 in 2025 (latest complete years).