Compositions for inhibiting corrosion
US-12441894-B2 · Oct 14, 2025 · US
Treatment of copper or alloys based thereon
Treatment of copper or alloys based thereon · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C22/52 |
| Official title | Treatment of copper or alloys based thereon |
| Display label | Treatment of copper or alloys based thereon |
| Total patents | 50 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 2 |
| 2017 | 2 |
| 2018 | 6 |
| 2019 | 2 |
| 2020 | 5 |
| 2021 | 5 |
| 2022 | 3 |
| 2023 | 9 |
| 2024 | 5 |
| 2025 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Laminate, metal plating solution, and manufacturing process of laminate
US-12371792-B2 · Jul 29, 2025 · US
Chemically anchored mold compounds in semiconductor packages
US-2025236955-A1 · Jul 24, 2025 · US
Composite copper components
US-12336116-B2 · Jun 17, 2025 · US
Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate
US-12284766-B2 · Apr 22, 2025 · US
Surface treatment agent, surface treatment method, and area-selective film forming method on substrate surface
US-2025059389-A1 · Feb 20, 2025 · US
Patinated or patina-ready metal transaction cards and manufacturing processes
US-12208599-B2 · Jan 28, 2025 · US
Fastener member
US-12188131-B2 · Jan 7, 2025 · US
Chemically anchored mold compounds in semiconductor packages
US-12180595-B2 · Dec 31, 2024 · US
Compositions for inhibiting corrosion
US-2024287319-A1 · Aug 29, 2024 · US
Compositions for inhibiting corrosion
US-11987726-B2 · May 21, 2024 · US
Method for anti-corrosion treatment of metallic copper-containing materials
US-11982002-B2 · May 14, 2024 · US
Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer
US-11963308-B2 · Apr 16, 2024 · US
Home appliance metal materials chemically resistant to peroxide degradation
US-11851765-B2 · Dec 26, 2023 · US
Composite copper foil
US-11781236-B2 · Oct 10, 2023 · US
Chemically anchored mold compounds in semiconductor packages
US-2023272536-A1 · Aug 31, 2023 · US
Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate
US-2023269879-A1 · Aug 24, 2023 · US
Compositions for inhibiting corrosion
US-2023159765-A1 · May 25, 2023 · US
Composite copper components
US-2023142375-A1 · May 11, 2023 · US
Laminate, metal plating solution, and manufacturing process of laminate
US-2023143193-A1 · May 11, 2023 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C22/52?
- CPC C23C22/52 is the Cooperative Patent Classification code for “Treatment of copper or alloys based thereon.”
- How many patents are filed under CPC C23C22/52 (Treatment of copper or alloys based thereon)?
- Our database includes 50 publications tagged with this CPC code.
- Is patent activity under CPC C23C22/52 growing?
- Publication counts under this code: 5 in 2024 vs 8 in 2025 (latest complete years).