Laminate, metal plating solution, and manufacturing process of laminate

Patent metadata

Field	Value
Publication number	US-12371792-B2
Application number	US-202017915409-A
Country	US
Kind code	B2
Filing date	Oct 7, 2020
Priority date	Mar 31, 2020
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

The preset invention has as its object the provision of a laminate free of hexavalent chromium and excellent in corrosion resistance and wear resistance, and a manufacturing process of the laminate. To solve the above-described problems, a laminate according to the present invention includes a substrate, and a laminated film portion with metal films laminated in two or more layers. The laminate has an interface layer between each two adjacent ones of the metal films. The laminated film portion contains a first metal element as a principal component, the first metal element being at least one element of Ni, Cr, Co, and W, and a second metal element that is a metal element of smaller cohesive energy than that of the first metal element. The second metal element contained in the interface layer is at a content ratio higher than that of the second metal element contained in each of the adjacent metal films.

First claim

The invention claimed is:

1. A laminate comprising:
a substrate; and
a laminated film portion with metal films laminated in two or more layers, wherein
the laminate has an interface layer between each two adjacent ones of the metal films, wherein only the interface layer contains S,
the laminated film portion contains a first metal element as a principal component, the first metal element is Ni and a second metal element is a metal element of smaller cohesive energy than that of the first metal element,
a concentration of the first metal element in the metal films is 90 at % or higher, and a concentration of the second metal element in the metal films is 1 at % or less,
the metals films contain at least one of P or B at a concentration in the metal films 3 at % or higher based on the concentration of the first metal element in the metal films, and
the second metal element contained in the interface layer is at a content ratio higher than that of the second metal element contained in each of the adjacent metal films.

2. The laminate according to claim 1 , wherein the second metal element is at least one selected from Cu, Sn, Zn, Ag, Mn, Bi, In, and Sb.

3. The laminate according to claim 1 , wherein the second metal element is nobler than a standard electrode potential of the metal films.

4. The laminate according to claim 1 , wherein the second metal element is Cu.

5. The laminate according to claim 1 , wherein the interface layer has a thickness of 100 nm or smaller.

6. The laminate according to claim 1 , wherein the interface layer has a thickness of 10 nm or smaller.

7. The laminate according to claim 1 , wherein the metal films are crystalline.

8. The laminate according to claim 7 , wherein crystals precipitated in the metal films have a (100) orientation.

9. The laminate according to claim 7 , wherein crystals precipitated in the metal films have a crystallite size of 10 nm or smaller.

10. The laminate according to claim 1 , wherein the metal films have a thickness of 8 nm or greater but 500 nm or smaller.

11. The laminate according to claim 1 , wherein a principal component of the substrate is copper.

12. A manufacturing process of the laminate according to claim 1 , comprising:
a plurality of plating treatment steps of metal films; and
a plating treatment stopping step between each two successive ones of the plating treatment steps.

Assignees

• Hitachi Ltd

Inventors

• Aoyagi Takuya
• Kanemoto Hiroshi
• Iwasaki Tomio
• Kawamura Toshinori
• Suzuki Hitoshi

Classifications

• C23C22/77

  Controlling or regulating of the coating process · CPC title

• C25D5/10

  Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · CPC title

• C25D5/617

  Crystalline layers · CPC title

• C25D5/50

  by heat-treatment · CPC title

• C25D3/562

  containing more than 50% by weight of iron or nickel or cobalt · CPC title