Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate

Patent metadata

Field	Value
Publication number	US-12284766-B2
Application number	US-202118003866-A
Country	US
Kind code	B2
Filing date	Jun 28, 2021
Priority date	Jun 29, 2020
Publication date	Apr 22, 2025
Grant date	Apr 22, 2025

Abstract

A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

First claim

What is claimed is:

1. A method for preparing a ceramic copper clad laminate, comprising following steps:
forming a copper oxide layer on a surface of a copper material;
thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms into the copper material;
removing the copper oxide layer on the thermally treated copper material by pickling or grinding, and
soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain the ceramic copper clad laminate.

2. The method according to claim 1 , wherein the forming the copper oxide layer comprises chemically oxidizing the copper material.

3. The method according to claim 2 , wherein the chemically oxidizing is carried out by at least one of following methods:
(1) treating the copper material with a mixture solution of hypochlorite and a strong base;
(2) treating the copper material with a mixture solution of a strong acid and hydrogen peroxide; or
(3) treating the copper material with an acidic persulfate solution.

4. The method according to claim 3 , wherein the chemically oxidizing is carried out by at least one of following methods:
(1) oxidizing with an oxidizing solution containing 10-200 g/L of hypochlorite and 10-100 g/L of a strong base at 30-100° C. for 5-100 min;
(2) oxidizing with an oxidizing solution containing 10-200 g/L of a strong acid and 10-150 g/L of H 2 O 2 at 30-80° C. for 5-40 min; or
(3) oxidizing with an oxidizing solution containing 30-150 g/L of persulfate at 30-80° C. and PH<4 for 5-40 min.

5. The method according to claim 1 , wherein the copper oxide layer has a thickness of 0.5-3 μm.

6. The method according to claim 1 , wherein a temperature of the thermally treating is 400-900° C., and a time of the thermally treating is 5-100 min.

7. The method according to claim 1 , wherein the thermally treating is carried out under a vacuum or inert gas condition.

8. The method according to claim 1 , wherein in the copper-oxide-layer-removed copper material, a mass of oxygen element is 0.001-0.01% of a mass of the copper material.

9. The method according to claim 1 , wherein the soldering is active metal soldering, and the active metal soldering comprises steps of:
arranging an active metal solder on a surface of the ceramic substrate;
covering the active metal solder with the copper-oxide-layer-removed copper material; and
soldering in a vacuum environment to form a copper layer on the ceramic substrate to obtain the ceramic copper clad laminate.

10. The method according to claim 1 , wherein after the soldering, a grain size of copper on a side of the copper material away from the ceramic substrate is 10-200 μm.

11. The method according to claim 1 , wherein the ceramic substrate comprises nitride ceramic.

12. The method according to claim 1 , further comprising: cleaning the copper material before forming the copper oxide layer on the surface of the copper material.

13. The method according to claim 12 , a reagent used in the cleaning comprises at least one of sodium hydroxide, sulfuric acid, sodium citrate, acetone, or ethanol.

14. A ceramic copper clad laminate, prepared by the method according to claim 1 .

15. A ceramic copper clad laminate of claim 1 , comprising a ceramic substrate, an active metal soldering layer, and a copper layer laminated in sequence, wherein, the copper layer contains oxygen element.

16. The ceramic copper clad laminate according to claim 15 , wherein in the copper layer, a mass of the oxygen element is 0.002-0.005% of a mass of the copper layer.

17. The ceramic copper clad laminate according to claim 15 , wherein a grain size of copper on a side of the copper layer away from the active metal soldering layer is 10-200 μm.

18. The ceramic copper clad laminate according to claim 15 , wherein the ceramic substrate is nitride ceramic.

Assignees

• Byd Co Ltd

Inventors

• Zhou Wei
• Xu Qiang
• Xie Caicai

Classifications

• H05K2203/1105

  Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating · CPC title

• H05K2203/0786

  Using an aqueous solution, e.g. for cleaning or during drilling of holes · CPC title

• H05K3/385

  by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• C23C22/52

  Treatment of copper or alloys based thereon · CPC title