Method for anti-corrosion treatment of metallic copper-containing materials

Patent metadata

Field	Value
Publication number	US-11982002-B2
Application number	US-201816641780-A
Country	US
Kind code	B2
Filing date	Aug 17, 2018
Priority date	Aug 28, 2017
Publication date	May 14, 2024
Grant date	May 14, 2024

Abstract

An anticorrosion treatment method for a copper-containing material comprises: carrying out a sealed and pressurized reaction on a copper-containing material and a stabilizer in presence of a polar solvent and any assistant, the stabilizer being a compound capable of providing formates, so that the formates are adsorbed on the surface of the copper-containing material. In the method, formates are modified on the surface of the copper-containing material, accordingly, the oxidation resistance capability and the stability of the copper-containing material can be significantly improved while the electrical conductivity of the copper-containing material is not reduced, and the corrosion resistance of the copper-containing material and especially, the salt and alkali corrosion resistance of the copper-containing material are significantly improved.

First claim

What is claimed is:

1. A method for anti-corrosion treatment of metallic copper-containing materials, comprising subjecting the metallic copper-containing materials and a stabilizer to a sealing and pressurizing reaction in the presence of a polar solvent and an additive,
wherein the sealing and pressurizing reaction is conducted at a temperature of 120-180° C. for a time of 6-30 h,
wherein the stabilizer is a compound capable of providing a formate, so that the formate is adsorbed on the surfaces of the metallic copper-containing materials, wherein the stabilizer is a formate salt, and wherein the formate salt is at least one selected from lithium formate, sodium formate, cesium formate, magnesium formate, aluminium triformate, potassium formate, ammonium formate, calcium formate, iron formate, strontium formate, barium formate, beryllium formate, nickel formate, cobalt formate, and manganese formate,
wherein the additive is oleylamine,
wherein the metallic copper-containing materials are copper nanowires, a diameter of the copper nanowires being 10-200 nm, the method for anti-corrosion treatment comprises the following steps:
1) Adding the copper nanowire into a dispersant, then adding the polar solvent and the oleylamine, the polar solvent being a polar organic solvent and/or water, and mixing to obtain a copper nanowire dispersion solution; wherein the dispersant is polyvinylpyrrolidone;
2) Adding the stabilizer into the copper nanowire dispersion solution obtained in the Step 1), and mixing to obtain a mixed solution;
3) Placing the mixed solution into a pressurized and heated sealing system for a sealing reaction; and
4) cooling the mixed solution obtained in the Step 3), then performing liquid-solid separation, and washing.

2. The method for anti-corrosion treatment according to claim 1 , comprising drying after Step (4).

3. The method for anti-corrosion treatment according to claim 1 , wherein the mass ratio of the stabilizer to the copper nanowires is 10:1 to 1:10.

4. The method for anti-corrosion treatment according to claim 1 , wherein the polar organic solvent is at least one selected from an amide solvent, an alcohol solvent, an ester solvent, and an ether solvent.

5. The method for anti-corrosion treatment according to claim 4 , wherein the amide solvent is at least one selected from form amide, dimethylformamide, diethylformamide, dimethylacetamide, diethylacetamide, and dimethylpropionamide; the alcohol solvent is at least one selected from monohydric alcohol, dihydric alcohol and polyhydric alcohol; the ester solvent is at least one selected from ethyl acetate, methyl acetate, n-butyl acetate, n-pentyl acetate, ethyl valerate, ethyl propionate, ethyl butyrate, ethyl lactate, ethyl nonanoate, triethyl phosphate, ethyl caproate, ethyl formate, ethyl cyclohexanecarboxylate, ethyl heptanoate, and ethyl cinnamate; and the ether solvent is at least one selected from methyl ether, diethyl ether, diphenyl ether, ethylene oxide, and tetrahydrofuran.

6. The method for anti-corrosion treatment according to claim 1 , wherein the mass ratio of the copper nanowires is 50:1-1:100.

7. The method for anti-corrosion treatment according to claim 1 , wherein in the Step 1), the mass ratio of the dispersant to the copper nanowires is 100:1-1:100.

Assignees

• Univ Xiamen

Inventors

• Zheng Nanfeng
• Peng Jian
• Hao Shuqiang
• Wu Binghui
• Fang Xiaoliang

Classifications

• C23F11/122 Primary

  Alcohols; Aldehydes; Ketones · CPC title

• C22C9/00

  Alloys based on copper · CPC title

• C23F11/16

  Sulfur-containing compounds · CPC title

• C23C22/02 Primary

  using non-aqueous solutions · CPC title

• C23C22/52 Primary

  Treatment of copper or alloys based thereon · CPC title