Pretreatment method for electroless plating, and pretreatment solution for electroless plating
US-12529145-B2 · Jan 20, 2026 · US
This page is not indexed by search engines while we improve data quality.
using organic liquids
using organic liquids · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/26 |
| Official title | using organic liquids |
| Display label | using organic liquids |
| Total patents | 14 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2018 | 4 |
| 2019 | 3 |
| 2020 | 1 |
| 2021 | 2 |
| 2022 | 2 |
| 2024 | 1 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Polymer compositions suitable for producing plated products
US-12037688-B2 · Jul 16, 2024 · US
Polymer Compositions Suitable For Producing Plated Products
US-2022170162-A1 · Jun 2, 2022 · US
Method of manufacturing a semiconductor element front side electrode
US-11335595-B2 · May 17, 2022 · US
Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board
US-10927463-B2 · Feb 23, 2021 · US
Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board
US-2021047734-A1 · Feb 18, 2021 · US
Process for pretreatment of plastic surfaces for metallization
US-10822703-B2 · Nov 3, 2020 · US
Semiconductor element and method of manufacturing same
US-2019393173-A1 · Dec 26, 2019 · US
Non-roughened cu trace with anchoring to reduce insertion loss of high speed io routing in package substrate
US-2019295937-A1 · Sep 26, 2019 · US
Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board
US-2019264329-A1 · Aug 29, 2019 · US
Process for pretreatment of plastic surfaces for metallization
US-2018216233-A1 · Aug 2, 2018 · US
Process for metallizing plastic surfaces
US-2018202048-A1 · Jul 19, 2018 · US
Electroless plating method
US-2018179633-A1 · Jun 28, 2018 · US
Method for electroless plating
US-2018179634-A1 · Jun 28, 2018 · US