Method of producing electroconductive substrate, electronic device and display device
US-2020381266-A1 · Dec 3, 2020 · US
with use of metal first
with use of metal first · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/208 |
| Official title | {with use of metal first} |
| Display label | with use of metal first |
| Total patents | 87 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 13 |
| 2017 | 17 |
| 2018 | 4 |
| 2019 | 12 |
| 2020 | 8 |
| 2021 | 10 |
| 2022 | 5 |
| 2023 | 4 |
| 2024 | 3 |
| 2025 | 1 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of producing electroconductive substrate, electronic device and display device
US-10784122-B2 · Sep 22, 2020 · US
Compound, substrate for pattern formation, photodegradable coupling agent, pattern formation method, and transistor production method
US-2020233304-A1 · Jul 23, 2020 · US
Methods of generating managese (iii) ions in mixed aqueous acid solutions using ozone
US-2020181787-A1 · Jun 11, 2020 · US
Conductive laminate for touch panel, touch panel, and transparent conductive laminate
US-10619248-B2 · Apr 14, 2020 · US
Electroless deposition of metal on 3D-printed polymeric structures
US-10494721-B1 · Dec 3, 2019 · US
Electroless nickel plating of silicone rubber
US-2019352779-A1 · Nov 21, 2019 · US
Copper-containing articles
US-2019233660-A1 · Aug 1, 2019 · US
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US-10292265-B2 · May 14, 2019 · US
Multilayer compositions
US-2019085460-A1 · Mar 21, 2019 · US
Depositing a structurally hard, wear resistant metal coating onto a substrate
US-2019062922-A1 · Feb 28, 2019 · US
Method of producing electroconductive substrate, electronic device and display device
US-2019043736-A1 · Feb 7, 2019 · US
Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor
US-2019032219-A1 · Jan 31, 2019 · US
Method of manufacturing plated component
US-2019032235-A1 · Jan 31, 2019 · US
Method for producing electroconductive laminate, laminate, and electroconductive laminate
US-2019010608-A1 · Jan 10, 2019 · US
Electrically conductive material
US-10177465-B2 · Jan 8, 2019 · US
Method for producing plated component, plated component, catalytic activity inhibitor and composite material for electroless plating
US-2019008051-A1 · Jan 3, 2019 · US
Film having plated-layer precursor layer, film having patterned plated layer, electroconductive film, and touch panel
US-2018371618-A1 · Dec 27, 2018 · US
Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
US-10151035-B2 · Dec 11, 2018 · US
Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
US-9914115-B2 · Mar 13, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/208?
- CPC C23C18/208 is the Cooperative Patent Classification code for “with use of metal first.”
- How many patents are filed under CPC C23C18/208 (with use of metal first)?
- Our database includes 87 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/208 growing?
- Publication counts under this code: 3 in 2024 vs 1 in 2025 (latest complete years).