Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor

Patent metadata

Field	Value
Publication number	US-2019032219-A1
Application number	US-201816046359-A
Country	US
Kind code	A1
Filing date	Jul 26, 2018
Priority date	Jul 27, 2017
Publication date	Jan 31, 2019
Grant date	—

Abstract

A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

First claim

1 . A sheet material comprising a resin layer comprising a binder and a plurality of catalyst particles; an electroless plating film provided on the side of one main surface of the resin layer and comprising first electroless plating films and a second electroless plating film; and a base material provided on the side of the other main surface of the resin layer, wherein
at least some of the plurality of catalyst particles respectively have exposure surfaces exposed from the one main surface of the resin layer, and the plurality of exposure surfaces are scattered on the one main surface of the resin layer, the first electroless plating films are provided on the one main surface of the resin layer to respectively surround the plurality of exposure surfaces of the catalyst particles, and the second electroless plating film is provided to cover the first electroless plating films, and a main surface, on the side of the first electroless plating films, of the second electroless plating film forms concave portions, respectively, along surfaces of the first electroless plating films.

2 . The sheet material according to claim 1 , wherein an average value of respective longest diameters of the first electroless plating films is 18 to 90 nm when the one main surface of the resin layer is viewed in a planar view from the side of the electroless plating film.

3 . The sheet material according to claim 1 , wherein an area ratio of the first electroless plating films to the one main surface of the resin layer is 80 to 99% when the one main surface is viewed in a planar view from the side of the electroless plating film.

4 . The sheet material according to claim 1 , wherein a main surface, on the opposite side to the first electroless plating films, of the second electroless plating film is a rough surface.

5 . The sheet material according to claim 1 , wherein the base material is a transparent base material.

6 . A method for manufacturing a sheet material, comprising:
a step of forming a resin layer comprising a binder and a plurality of catalyst particles on a base material, at least some of the plurality of catalyst particles respectively having exposure surfaces exposed from one main surface of the resin layer, the plurality of exposure surfaces being scattered on the one main surface of the resin layer, and the base material being provided on the side of the other main surface of the resin layer; a step of forming first electroless plating films on the one main surface of the resin layer to respectively surround the plurality of exposure surfaces; and a step of forming a second electroless plating film to cover the first electroless plating films, a main surface, on the side of the first electroless plating films, of the second electroless plating film forming concave portions, respectively, along surfaces of the first electroless plating films.

7 . A method for manufacturing a metal mesh, comprising a step of performing etching for the electroless plating film in the sheet material according to claim 1 to form an electroless plating film having a mesh-shaped pattern.

8 . A method for manufacturing a wiring substrate, comprising a step of performing etching for the electroless plating film in the sheet material according to claim 1 to form an electroless plating film having a wiring pattern.

9 . A metal mesh comprising:
a resin layer comprising a binder and a plurality of catalyst particles; an electroless plating film provided to form a mesh-shaped pattern on the side of one main surface of the resin layer and comprising first electroless plating films and a second electroless plating film; and a base material provided on the side of the other main surface of the resin layer, wherein at least some of the plurality of catalyst particles respectively have exposure surfaces exposed from the one main surface of the resin layer, and the plurality of exposure surfaces are scattered on the one main surface of the resin layer, the first electroless plating films are provided on the one main surface of the resin layer to respectively surround the plurality of exposure surfaces of the catalyst particles, and the second electroless plating film is provided to cover the first electroless plating films, and a main surface, on the side of the first electroless plating films, of the second electroless plating film forms concave portions, respectively, along surfaces of the first electroless plating films.

10 . A metal mesh comprising:
a base material; a resin layer provided to form a mesh-shaped pattern on the base material and comprising a binder and a plurality of catalyst particles; and an electroless plating film provided on the base material along the mesh-shaped pattern of the resin layer while covering the resin layer and comprising first electroless plating films and a second electroless plating film, wherein at least some of the plurality of catalyst particles respectively have exposure surfaces exposed from a surface of the resin layer, and the plurality of exposure surfaces are scattered on the surface of the resin layer, the first electroless plating films are provided on the surface of the resin layer to respectively surround the plurality of exposure surfaces of the catalyst particles, and the second electroless plating film is provided to cover the first electroless plating films, and a surface, on the side of the first electroless plating films, of the second electroless plating film forms concave portions, respectively, along surfaces of the first electroless plating films.

11 . The metal mesh according to claim 9 , wherein a surface, on the opposite side to the first electroless plating films, of the second electroless plating film is a rough surface.

12 . A wiring substrate comprising:
a resin layer comprising a binder and a plurality of catalyst particles; an electroless plating film provided to form a wiring pattern on the side of one main surface of the resin layer and comprising first electroless plating films and a second electroless plating film; and a base material provided on the side of the other main surface of the resin layer, wherein at least some of the plurality of catalyst particles respectively have exposure surfaces exposed from the one main surface of the resin layer, and the plurality of exposure surfaces are scattered on the one main surface of the resin layer, the first electroless plating films are provided on the one main surface of the resin layer to respectively surround the plurality of exposure surfaces of the catalyst particles, and the second electroless plating film is provided to cover the first electroless plating films, and a main surface, on the side of the first electroless plating films, of the second electroless plating film forms concave portions, respectively, along surfaces of the first electroless plating films.

13 . A wiring substrate comprising:
a base material; a resin layer provided to form a wiring pattern on the base material and comprising a binder and a plurality of catalyst particles; and an electroless plating film provided on the base material along the wiring pattern of the resin layer while covering the resin layer and comprising first electroless plating films and a second electroless plating film, wherein at least some of the plurality of catalyst particles respectively have exposure surfaces exposed from the surface of the resin layer, and the plurality of exposure surfaces are scattered on the surface of the resin layer, the first electroless plating films are provided on the surface of the resin layer to respectively surround the plurality of exposure surfaces of the catalyst particle

Assignees

• Tdk Corp

Inventors

• Orikasa Makoto
• Horikawa Yuhei
• Kanbayashi Yoshihiro
• Abe Hisayuki

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W70/695

  Organic materials · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title