Method of producing electroconductive substrate, electronic device and display device

Patent metadata

Field	Value
Publication number	US-2020381266-A1
Application number	US-202016997092-A
Country	US
Kind code	A1
Filing date	Aug 19, 2020
Priority date	Jul 28, 2017
Publication date	Dec 3, 2020
Grant date	—

Abstract

A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

First claim

What is claimed is:

1 . A method of producing an electroconductive substrate including a base material, and an electroconductive pattern layer disposed on one main surface side of the base material, the method comprising:
a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer according to an imprint method including pushing a mold including a convex portion into the trench formation layer formed on the foundation layer which is formed on the base material; a step of adsorbing a catalyst in the foundation layer which is exposed to the bottom surface of the trench; and a step of forming the electroconductive pattern layer which includes metal plating and fills the trench, by growing the metal plating from the foundation layer in which the catalyst is adsorbed.

2 . The method according to claim 1 ,
wherein the metal plating is grown such that a gap is formed between at least a part of a lateral surface of the electroconductive pattern layer and the lateral surface of the trench.

3 . The method according to claim 1 , further comprising:
a step of blackening a surface of the electroconductive pattern layer, the surface including a surface on a side opposite to the bottom surface of the trench.

4 . The method according to claim 1 , further comprising:
a step of forming a protective film covering at least a part of a surface of the trench formation layer and the electroconductive pattern layer on a side opposite to the base material.

5 . The method according to claim 1 ,
wherein the electroconductive pattern layer forms a mesh-like pattern.

6 . A method of producing an electronic device including an electroconductive substrate which includes a base material, and an electroconductive pattern layer disposed on one main surface side of the base material, and an electronic component, the method comprising:
a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer according to an imprint method including pushing a mold including a convex portion into the trench formation layer formed on the foundation layer which is formed on the base material; a step of adsorbing a catalyst in the foundation layer which is exposed to the bottom surface of the trench; a step of forming the electroconductive pattern layer which includes metal plating and fills the trench, by growing the metal plating from the foundation layer in which the catalyst is adsorbed; and a step of mounting the electronic component on the electroconductive substrate including the base material and the electroconductive pattern layer.

7 . The method according to claim 6 ,
wherein the step of mounting the electronic component on the electroconductive substrate, includes forming a connection portion on the electroconductive pattern layer, and connecting the electronic component to the electroconductive pattern layer through the connection portion.

8 . The method according to claim 6 ,
wherein the step of mounting the electronic component on the electroconductive substrate, includes forming an adhesion layer on the electroconductive pattern layer, forming an insulating layer which covers a surface of the trench formation layer on a side opposite to the foundation layer, and includes an opening portion to which a part of the adhesion layer is exposed, forming a UBM layer on a surface of the adhesion layer which is exposed into the opening portion of the adhesion layer, forming a connection portion on the UBM layer, and connecting the electronic component to the electroconductive pattern layer through the connection portion, the UBM layer, and the adhesion layer.

9 . The method according to claim 6 ,
wherein the metal plating is grown such that a gap is formed between at least a part of a lateral surface of the electroconductive pattern layer and the lateral surface of the trench.

10 . A method of producing a display device including an electroconductive substrate which includes a base material, and an electroconductive pattern layer disposed on one main surface side of the base material, and a light emitting element, the method comprising:
a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer according to an imprint method including pushing a mold including a convex portion into the trench formation layer formed on the foundation layer which is formed on the base material; a step of adsorbing a catalyst in the foundation layer which is exposed to the bottom surface of the trench; a step of forming the electroconductive pattern layer which includes metal plating and fills the trench, by growing the metal plating from the foundation layer in which the catalyst is adsorbed; and a step of mounting the light emitting element on the electroconductive substrate including the base material and the electroconductive pattern layer.

11 . The method according to claim 10 ,
wherein the step of mounting the light emitting element on the electroconductive substrate, includes forming a connection portion on the electroconductive pattern layer, and connecting the light emitting element to the electroconductive pattern layer through the connection portion.

12 . The method according to claim 10 ,
wherein the step of mounting the light emitting element on the electroconductive substrate, includes forming an adhesion layer on the electroconductive pattern layer, forming an insulating layer which covers a surface of the trench formation layer on a side opposite to the foundation layer, and includes an opening portion to which a part of the adhesion layer is exposed, forming a UBM layer on a surface of the adhesion layer which is exposed into the opening portion of the adhesion layer, forming a connection portion on the UBM layer, and connecting the light emitting element to the electroconductive pattern layer through the connection portion, the UBM layer, and the adhesion layer.

13 . The method according to claim 10 ,
wherein the metal plating is grown such that a gap is formed between at least a part of a lateral surface of the electroconductive pattern layer and the lateral surface of the trench.

Assignees

• Tdk Corp

Inventors

• Daitoku Takashi
• Taniguchi Susumu
• Seki Akiko
• Sato Atsushi
• Horikawa Yuhei
• Orikasa Makoto
• Abe Hisayuki

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/01235

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title