Catalyst for water electrolysis using fluorine-doped tin oxide support and method for manufacturing the same
US-2025333846-A1 · Oct 30, 2025 · US
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Multistep pretreatment
Multistep pretreatment · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1886 |
| Official title | {Multistep pretreatment} |
| Display label | Multistep pretreatment |
| Total patents | 19 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 6 |
| 2017 | 2 |
| 2018 | 3 |
| 2019 | 1 |
| 2020 | 2 |
| 2021 | 1 |
| 2024 | 1 |
| 2025 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device including two-dimensional material and method of manufacturing the same
US-2024021683-A1 · Jan 18, 2024 · US
Linear shape member and producing method therefor
US-11164684-B2 · Nov 2, 2021 · US
Linear shape member and producing method therefor
US-2020234847-A1 · Jul 23, 2020 · US
Electroless plating method and ceramic substrate
US-10602617-B2 · Mar 24, 2020 · US
Adhesion promoting process for metallisation of substrate surfaces
US-10487404-B2 · Nov 26, 2019 · US
Electroless plating method and ceramic substrate
US-2018199442-A1 · Jul 12, 2018 · US
Electroless plating method and ceramic substrate
US-9949374-B2 · Apr 17, 2018 · US
Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
US-9914115-B2 · Mar 13, 2018 · US
Plating method, recording medium and plating system
US-9711363-B2 · Jul 18, 2017 · US
Method for no-silane electroless metal deposition using high adhesive catalyst and product therefrom
US-2017081766-A1 · Mar 23, 2017 · US
Plating method, recording medium and plating system
US-2016307759-A1 · Oct 20, 2016 · US
Novel adhesion promoting agents for metallisation of substrate surfaces
US-2016237571-A1 · Aug 18, 2016 · US
Novel adhesion promoting process for metallisation of substrate surfaces
US-2016208387-A1 · Jul 21, 2016 · US
Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
US-9364822-B2 · Jun 14, 2016 · US
Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
US-2016038925-A1 · Feb 11, 2016 · US
Electroless plating method and ceramic substrate
US-2016007476-A1 · Jan 7, 2016 · US
Catalysts for electroless metallization containing iminodiacetic acid and derivatives
US-2015024123-A1 · Jan 22, 2015 · US
Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
US-2015004323-A1 · Jan 1, 2015 · US