Manufacturing method of multilayer wiring and multilayer wiring structure
US-9468095-B1 · Oct 11, 2016 · US
Electroless plating method and ceramic substrate
US10602617B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10602617-B2 |
| Application number | US-201815913032-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 6, 2018 |
| Priority date | Feb 8, 2013 |
| Publication date | Mar 24, 2020 |
| Grant date | Mar 24, 2020 |
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- Title
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- Abstract
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Abstract
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An electroless plating method for a low temperature co-fired glass ceramic substrate includes: a degreasing and activation treatment step of degreasing and activating a surface of a wiring pattern formed of a silver sintered body; a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body; and an electroless multi-layered coating plating treatment step of forming a multi-layered electroless plating coating on the surface of the wiring pattern formed of a silver sintered body. The method further includes, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, and the catalyzing step includes providing the catalyst also to the silver precipitated in the silver precipitation treatment step.
First claim
Opening claim text (preview).
The invention claimed is: 1. A glass ceramic substrate, comprising an insulating base material formed of glass ceramic, and a wiring pattern formed of a silver sintered body, precipitated silver being scattered in a particulate form on a glass component present on a surface of the wiring pattern formed of a silver sintered body, a nickel plating coating being formed on the wiring pattern formed of a silver sintered body including the glass component and the silver scattered on the glass component, a palladium plating coating being formed on the nickel plating coating, a gold plating coating being formed on the palladium plating coating. 2. A glass ceramic substrate, comprising an insulating base material formed of glass ceramic, and a wiring pattern formed of a silver sintered body, precipitated silver being scattered in a particulate form on a glass component present on a surface of the wiring pattern formed of a silver sintered body, a nickel plating coating being formed on the wiring pattern formed of a silver sintered body including the glass component and the silver scattered on the glass component, a gold plating coating being formed on the nickel plating coating. 3. A glass ceramic substrate according to claim 1 , wherein the silver scattered in a particulate form on the glass component present on the surface of the wiring pattern formed of a silver sintered body has a particle size of from 10 to 100 nm. 4. A glass ceramic substrate according to claim 2 , wherein the silver scattered in a particulate form on the glass component present on the surface of the wiring pattern formed of a silver sintered body has a particle size of from 10 to 100 nm.
Assignees
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Classifications
Multistep pretreatment · CPC title
Dispersed materials, e.g. conductive pastes or inks · CPC title
including metal layer · CPC title
Contact plating, i.e. electroless electrochemical plating · CPC title
Substrates other than metallic, e.g. inorganic or organic or non-conductive · CPC title
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Frequently asked questions
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- What does patent US10602617B2 cover?
- An electroless plating method for a low temperature co-fired glass ceramic substrate includes: a degreasing and activation treatment step of degreasing and activating a surface of a wiring pattern formed of a silver sintered body; a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body; and an electroless multi-layered coating plating tr…
- Who is the assignee on this patent?
- Mitsubishi Electric Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K3/185. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 24 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).