Apparatus and method of damage mitigation and step coverage enhancement
US-12580152-B2 · Mar 17, 2026 · US
Inductive energy
Inductive energy · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C14/358 |
| Official title | {Inductive energy} |
| Display label | Inductive energy |
| Total patents | 52 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 4 |
| 2017 | 3 |
| 2018 | 3 |
| 2020 | 6 |
| 2021 | 4 |
| 2022 | 5 |
| 2023 | 9 |
| 2024 | 6 |
| 2025 | 6 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Plasma producing apparatus
US-12555743-B2 · Feb 17, 2026 · US
Heterogeneous coated steel sheet having excellent workability and corrosion resistance, and method for manufacturing same
US-2026002248-A1 · Jan 1, 2026 · US
Sacrificial liner for copper interconnect
US-2025277312-A1 · Sep 4, 2025 · US
Method and apparatus for use in generating plasma
US-12315697-B2 · May 27, 2025 · US
Apparatus and method of damage mitigation and step coverage enhancement
US-2025157790-A1 · May 15, 2025 · US
Cathode unit for magnetron sputtering apparatus and magnetron sputtering apparatus
US-12293905-B2 · May 6, 2025 · US
Sputtering of high-quality superconducting thin films
US-2025129468-A1 · Apr 24, 2025 · US
System and method for particle control in mram processing
US-2025095975-A1 · Mar 20, 2025 · US
System and method for particle control in MRAM processing
US-12176192-B2 · Dec 24, 2024 · US
Etch uniformity improvement for single turn internal coil PVD chamber
US-12136544-B2 · Nov 5, 2024 · US
Top magnets for decreased non-uniformity in PVD
US-12112890-B2 · Oct 8, 2024 · US
Methods and apparatus for reducing sputtering of a grounded shield in a process chamber
US-2024186128-A1 · Jun 6, 2024 · US
Semiconductor Device, Method and Machine of Manufacture
US-2024093357-A1 · Mar 21, 2024 · US
Methods and apparatus for reducing sputtering of a grounded shield in a process chamber
US-11915917-B2 · Feb 27, 2024 · US
Semiconductor device, method and machine of manufacture
US-11851749-B2 · Dec 26, 2023 · US
System and method for particle control in mram processing
US-2023386806-A1 · Nov 30, 2023 · US
Method and apparatus for use in generating plasma
US-2023352270-A1 · Nov 2, 2023 · US
System and method for particle control in MRAM processing
US-11776796-B2 · Oct 3, 2023 · US
Lattice coat surface enhancement for chamber components
US-11739411-B2 · Aug 29, 2023 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C14/358?
- CPC C23C14/358 is the Cooperative Patent Classification code for “Inductive energy.”
- How many patents are filed under CPC C23C14/358 (Inductive energy)?
- Our database includes 52 publications tagged with this CPC code.
- Is patent activity under CPC C23C14/358 growing?
- Publication counts under this code: 6 in 2024 vs 6 in 2025 (latest complete years).