Ni ball, Ni nuclear ball, solder joint, foam solder and solder paste

Patent metadata

Field	Value
Publication number	US-9816160-B2
Application number	US-201315022320-A
Country	US
Kind code	B2
Filing date	Sep 19, 2013
Priority date	Sep 19, 2013
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

To provide a Ni ball having a low α dose and high sphericity even when it contains impurity elements other than Ni in certain amounts. The Ni ball contains an element U, a content thereof being 5 ppb or less, and an element Th, a content thereof being 5 ppb or less, wherein a purity of the Ni ball is 99.9% or more but 99.995% or less, an α dose thereof is 0.0200 cph/cm 2 or less, a content of either Pb or Bi, or a total content of both Pb and Bi is 1 ppm or more, and a sphericity thereof is 0.90 or more, in order to prevent any software errors and reduce connection failure.

First claim

The invention claimed is:

1. An Ni ball comprising:
an element U, a content thereof being 5 ppb or less; and
an element Th, a content thereof being 5 ppb or less;
wherein a purity of the Ni ball is 99.9% by mass or more but 99.995% by mass or less, an α dose thereof is 0.0200 cph/cm 2 or less, a content of either Pb or Bi, or a total content of both Pb and Bi is 1 ppm or more, and a sphericity thereof is 0.90 or more.

2. The Ni ball of claim 1 , wherein the α dose is 0.0020 cph/cm 2 or less.

3. The Ni ball of claim 1 , wherein the α dose is 0.0010 cph/cm 2 or less.

4. The Ni ball of claim 1 , wherein the diameter thereof is from 1 to 1000 μm.

5. Foam solder including the Ni ball of claim 1 , the Ni ball being dispersed in the solder.

6. Solder paste including the Ni ball of claim 1 .

7. An Ni core ball including the Ni ball of claim 1 , and solder plating coating the Ni ball.

8. The Ni core ball of claim 7 , wherein the α dose is 0.0200 cph/cm 2 or less.

9. The Ni core ball of claim 7 , wherein the α dose is 0.0020 cph/cm 2 or less.

10. The Ni core ball of claim 7 , wherein the α dose is 0.0010 cph/cm 2 or less.

11. Foam solder including the Ni core ball of claim 7 , the Ni core ball being dispersed in the solder.

12. Solder paste including the Ni core ball of claim 7 .

13. A solder joint including the Ni ball of claim 1 .

14. A solder joint including the Ni core ball of claim 7 .

15. The Ni ball of claim 2 , wherein the diameter thereof is from 1 to 1000 μm.

16. The Ni ball of claim 3 , wherein the diameter thereof is from 1 to 1000 μm.

17. Foam solder including the Ni ball of claim 2 , the Ni ball being dispersed in the solder.

18. Foam solder including the Ni ball of claim 3 , the Ni ball being dispersed in the solder.

19. Foam solder including the Ni core ball of claim 8 , the Ni core ball being dispersed in the solder.

20. Foam solder including the Ni core ball of claim 9 , the Ni core ball being dispersed in the solder.

Assignees

• Senju Metal Industry Co

Inventors

• Kurata Ryoichi
• AKAGAWA Takashi
• Kawasaki Hiroyoshi

Classifications

• B22F1/065

  Spherical particles · CPC title

• B22F1/17

  Metallic particles coated with metal · CPC title

• B22F1/05

  Metallic powder characterised by the size or surface area of the particles · CPC title

• B22F2301/30

  Low melting point metals, i.e. Zn, Pb, Sn, Cd, In, Ga · CPC title

• B23K35/3033

  Ni as the principal constituent · CPC title