High-temperature lead-free solder alloy

Patent metadata

Field	Value
Publication number	US-9796053-B2
Application number	US-201314420413-A
Country	US
Kind code	B2
Filing date	Jul 29, 2013
Priority date	Aug 10, 2012
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250° C. In order to make the structure of an Sn—Sb—Ag—Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.

First claim

The invention claimed is:

1. A high-temperature lead-free solder alloy having an alloy composition comprising: 35 to 40 wt % of Sb, 8 to 25 wt % of Ag, 5 to 10 wt % of Cu as well as at least one selected from the group consisting of 0.003 to 1.0 wt % of Al, 0.01 to 0.2 wt % of Fe and 0.005 to 0.4 wt % of Ti, and a balance of Sn.

2. The high-temperature lead-free solder alloy according to claim 1 , further comprising at least one selected from the group consisting of P, Ge and Ga in a total amount of 0.002 to 0.1 wt %.

3. The high-temperature lead-free solder alloy according to claim 1 , further comprising at least one selected from the group consisting of Ni, Co and Mn in a total amount of 0.01 to 0.5 wt.

4. The high-temperature lead-free solder alloy according to claim 1 , further comprising at least one selected from the group consisting of Zn and Bi in a total amount of 0.005 to 0.5 wt %.

5. The high-temperature lead-free solder alloy according to claim 1 , further comprising at least one selected from the group consisting of Au, Ce, In, Mo, Nb, Pd, Pt, V, Ca, Mg and Zr in a total amount of 0.0005 to 1 wt %.

6. The high-temperature lead-free solder alloy according to claim 2 , further comprising at least one selected from the group consisting of Ni, Co and Mn in a total amount of 0.01 to 0.5 wt %.

7. The high-temperature lead-free solder alloy according to claim 2 , further comprising at least one selected from the group consisting of Zn and Bi in a total amount of 0.005 to 0.5 wt %.

8. The high-temperature lead-free solder alloy according to claim 3 , further comprising at least one selected from the group consisting of Zn and Bi in a total amount of 0.005 to 0.5 wt %.

9. The high-temperature lead-free solder alloy according to claim 6 , further comprising at least one selected from the group consisting of Zn and Bi in a total amount of 0.005 to 0.5 wt %.

10. The high-temperature lead-free solder alloy according to claim 2 , further comprising at least one selected from the group consisting of Au, Ce, In, Mo, Nb, Pd, Pt, V, Ca, Mg and Zr in a total amount of 0.0005 to 1 wt %.

11. The high-temperature lead-free solder alloy according to claim 3 , further comprising at least one selected from the group consisting of Au, Ce, In, Mo, Nb, Pd, Pt, V, Ca, Mg and Zr in a total amount of 0.0005 to 1 wt %.

12. The high-temperature lead-free solder alloy according to claim 4 , further comprising at least one selected from the group consisting of Au, Ce, In, Mo, Nb, Pd, Pt, V, Ca, Mg and Zr in a total amount of 0.0005 to 1 wt %.

13. The high-temperature lead-free solder alloy according to claim 6 , further comprising at least one selected from the group consisting of Au, Ce, In, Mo, Nb, Pd, Pt, V, Ca, Mg and Zr in a total amount of 0.0005 to 1 wt %.

14. The high-temperature lead-free solder alloy according to claim 7 , further comprising at least one selected from the group consisting of Au, Ce, In, Mo, Nb, Pd, Pt, V, Ca, Mg and Zr in a total amount of 0.0005 to 1 wt %.

15. The high-temperature lead-free solder alloy according to claim 8 , further comprising at least one selected from the group consisting of Au, Ce, In, Mo, Nb, Pd, Pt, V, Ca, Mg and Zr in a total amount of 0.0005 to 1 wt %.

16. The high-temperature lead-free solder alloy according to claim 9 , further comprising at least one selected from the group consisting of Au, Ce, In, Mo, Nb, Pd, Pt, V, Ca, Mg and Zr in a total amount of 0.0005 to 1 wt %.

17. A solder paste comprising the high-temperature lead-free solder alloy according to claim 1 .

18. A solder preform comprising the high-temperature lead-free solder alloy according to claim 1 .

19. A solder joint formed using the high-temperature lead-free solder alloy according to claim 1 .

Assignees

• Senju Metal Industry Co

Inventors

• FUJIMAKI Rei
• Ueshima Minoru

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H05K3/346

  Solder materials or compositions specially adapted therefor · CPC title

• C22C30/04

  containing tin or lead · CPC title

• B23K35/26

  with the principal constituent melting at less than 400°C · CPC title

• B23K2101/40

  Semiconductor devices · CPC title