Flexible non-chromate corrosion inhibitive primer
US-2016369126-A1 · Dec 22, 2016 · US
Epoxynovolacs
Epoxynovolacs · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08L63/04 |
| Official title | Epoxynovolacs |
| Display label | Epoxynovolacs |
| Total patents | 517 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 38 |
| 2016 | 59 |
| 2017 | 60 |
| 2018 | 41 |
| 2019 | 47 |
| 2020 | 57 |
| 2021 | 58 |
| 2022 | 53 |
| 2023 | 31 |
| 2024 | 31 |
| 2025 | 36 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board
US-2016369032-A1 · Dec 22, 2016 · US
Novel novolac curing agent with alkoxysilyl group, method for preparing the same, composition containing the same, the cured product, and use thereof
US-2016326299-A1 · Nov 10, 2016 · US
Resist composition and method for producing resist pattern
US-2016291464-A1 · Oct 6, 2016 · US
Resist composition and method for producing resist pattern
US-2016291466-A1 · Oct 6, 2016 · US
A curable epoxy resin composition
US-2016257811-A1 · Sep 8, 2016 · US
Resin composition for encapsulating a semiconductor element and a semiconductor device
US-2016251511-A1 · Sep 1, 2016 · US
Photosensitive resin composition and photosensitive film using same
US-9403977-B2 · Aug 2, 2016 · US
Curable epoxy compositions
US-2016208091-A1 · Jul 21, 2016 · US
Polythioether sealants with enhanced thermal resistance
US-9382448-B2 · Jul 5, 2016 · US
Phosphine-catalyzed, michael addition-curable sulfur-containing polymer compositions
US-2016186025-A1 · Jun 30, 2016 · US
Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same
US-2016185939-A1 · Jun 30, 2016 · US
Resin composition and laminate for printed circuit board comprising same
US-2016150644-A1 · May 26, 2016 · US
Composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
US-2016130432-A1 · May 12, 2016 · US
Waterborne adhesives for elastomers
US-9328270-B2 · May 3, 2016 · US
Epoxy resin composition for resin transfer molding of fiber-reinforced composite material, fiber-reinforced composite material, and method for producing same
US-9309352-B2 · Apr 12, 2016 · US
Epoxy resin composition for encapsulating semiconductor device and semiconductor package encapsulated using the same
US-2016093547-A1 · Mar 31, 2016 · US
Low temperature curable epoxy compositions
US-9279032-B2 · Mar 8, 2016 · US
Carbon fiber-reinforced thermoplastic resin composition, molding material, prepreg, and methods for producing same
US-9249295-B2 · Feb 2, 2016 · US
Compositions and methods to produce triazine-arylhydroxy-aldehyde condensates with improved solubility
US-9249251-B2 · Feb 2, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08L63/04?
- CPC C08L63/04 is the Cooperative Patent Classification code for “Epoxynovolacs.”
- How many patents are filed under CPC C08L63/04 (Epoxynovolacs)?
- Our database includes 517 publications tagged with this CPC code.
- Is patent activity under CPC C08L63/04 growing?
- Publication counts under this code: 31 in 2024 vs 36 in 2025 (latest complete years).