Photosensitive resin composition and photosensitive film using same

US9403977B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9403977-B2
Application numberUS-201314651081-A
CountryUS
Kind codeB2
Filing dateDec 5, 2013
Priority dateDec 12, 2012
Publication dateAug 2, 2016
Grant dateAug 2, 2016

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  5. First independent claim

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Abstract

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The present invention relates to a positive-type photosensitive resin composition comprising (A) a modified novolac-type phenol resin having an unsaturated hydrocarbon group, (B) a novolac-type phenol resin obtained from metacresol and paracresol, (C) a novolac-type phenol resin obtained from orthocresol, (D) a compound generating an acid by light, and (E) a polybasic acid or a polybasic acid anhydride, wherein the content of the (E) component is lower than 40 parts by mass per 100 parts by mass of the total amount of the (A) component, the (B) component, the (C) component and the (D) component.

First claim

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The invention claimed is: 1. A positive-type photosensitive resin composition, comprising: (A) a modified novolac-type phenol resin having an unsaturated hydrocarbon group; (B) a novolac-type phenol resin obtained from metacresol and paracresol; (C) a novolac-type phenol resin obtained from orthocresol; (D) a compound generating an acid by light; and (E) a polybasic acid or a polybasic acid anhydride, wherein a content of the polybasic acid or a polybasic acid anhydride is lower than 40 parts by mass per 100 parts by mass of a total amount of the modified novolac-type phenol resin having an unsaturated hydrocarbon group, the novolac-type phenol resin obtained from metacresol and paracresol, the novolac-type phenol resin obtained from orthocresol and the compound generating an acid by light. 2. The positive-type photosensitive resin composition according to claim 1 , wherein a weight-average molecular weight of the modified novolac-type phenol resin having an unsaturated hydrocarbon group is 1000 to 15000. 3. The positive-type photosensitive resin composition according to claim 1 , wherein a weight-average molecular weight of the novolac-type phenol resin obtained from metacresol and paracresol is 800 to 50000. 4. The positive-type photosensitive resin composition according to claim 1 , wherein a weight-average molecular weight of the novolac-type phenol resin obtained from orthocresol is 800 to 5000. 5. The positive-type photosensitive resin composition according to claim 1 , wherein a content of the novolac-type phenol resin obtained from orthocresol is 20 to 60 parts by mass per 100 parts by mass of a total amount of the modified novolac-type phenol resin having an unsaturated hydrocarbon group, the novolac-type phenol resin obtained from metacresol and paracresol, the novolac-type phenol resin obtained from orthocresol and the compound generating an acid by light. 6. The positive-type photosensitive resin composition according to claim 1 , wherein the unsaturated hydrocarbon group has 4 to 100 carbon atoms. 7. The positive-type photosensitive resin composition according to claim 1 , further comprising a fluorine-based surfactant. 8. The positive-type photosensitive resin composition according to claim 1 , further comprising an adhesivity-imparting agent. 9. A photosensitive film, comprising: a support film at least one surface of which has been subjected to a release treatment; and a photosensitive layer provided on the surface of the support film which has been subjected to the release treatment, wherein the photosensitive layer is a layer formed of the positive-type photosensitive resin composition according to claim 1 . 10. The positive-type photosensitive resin composition according to claim 1 , wherein the content of the polybasic acid or the polybasic acid anhydride is lower than 35 parts by mass per 100 parts by mass of a total amount of the modified novolac-type phenol resin having an unsaturated hydrocarbon group, the novolac-type phenol resin obtained from metacresol and paracresol, the novolac-type phenol resin obtained from orthocresol and the compound generating an acid by light. 11. The positive-type photosensitive resin composition according to claim 10 , wherein the content of the polybasic acid or the polybasic acid anhydride is higher than 0.1 parts by mass per 100 parts by mass of a total amount of the modified novolac-type phenol resin having an unsaturated hydrocarbon group, the novolac-type phenol resin obtained from metacresol and paracresol, the novolac-type phenol resin obtained from orthocresol and the compound generating an acid by light. 12. The positive-type photosensitive resin composition according to claim 10 , wherein the content of the polybasic acid or the polybasic acid anhydride is higher than 1 part by mass per 100 parts by mass of a total amount of the modified novolac-type phenol resin having an unsaturated hydrocarbon group, the novolac-type phenol resin obtained from metacresol and paracresol, the novolac-type phenol resin obtained from orthocresol and the compound generating an acid by light. 13. The positive-type photosensitive resin composition according to claim 1 , wherein the content of the polybasic acid or the polybasic acid anhydride is lower than 30 parts by mass per 100 parts by mass of a total amount of the modified novolac-type phenol resin having an unsaturated hydrocarbon group, the novolac-type phenol resin obtained from metacresol and paracresol, the novolac-type phenol resin obtained from orthocresol and the compound generating an acid by light. 14. The positive-type photosensitive resin composition according to claim 13 , wherein the content of the polybasic acid or the polybasic acid anhydride is higher than 0.1 parts by mass per 100 parts by mass of a total amount of the modified novolac-type phenol resin having an unsaturated hydrocarbon group, the novolac-type phenol resin obtained from metacresol and paracresol, the novolac-type phenol resin obtained from orthocresol and the compound generating an acid by light. 15. The positive-type photosensitive resin composition according to claim 13 , wherein the content of the polybasic acid or the polybasic acid anhydride is higher than 1 part by mass per 100 parts by mass of a total amount of the modified novolac-type phenol resin having an unsaturated hydrocarbon group, the novolac-type phenol resin obtained from metacresol and paracresol, the novolac-type phenol resin obtained from orthocresol and the compound generating an acid by light.

Assignees

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Classifications

  • Manufacture of films or sheets · CPC title

  • Macromolecular quinonediazides; Macromolecular additives, e.g. binders {(G03F7/0226 takes precedence)} · CPC title

  • containing three or more polymers in a blend · CPC title

  • containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

  • Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins · CPC title

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What does patent US9403977B2 cover?
The present invention relates to a positive-type photosensitive resin composition comprising (A) a modified novolac-type phenol resin having an unsaturated hydrocarbon group, (B) a novolac-type phenol resin obtained from metacresol and paracresol, (C) a novolac-type phenol resin obtained from orthocresol, (D) a compound generating an acid by light, and (E) a polybasic acid or a polybasic acid a…
Who is the assignee on this patent?
Hitachi Chemical Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08L63/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 02 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).