Curable epoxy compositions

Patent metadata

Field	Value
Publication number	US-2016208091-A1
Application number	US-201414910323-A
Country	US
Kind code	A1
Filing date	Sep 16, 2014
Priority date	Sep 26, 2013
Publication date	Jul 21, 2016
Grant date	—

Abstract

Curable compositions comprising an epoxy mixture comprising a) an epoxy mixture comprising i) a first epoxy component comprising epoxy phenol novolac oligomers having a content of 2-functional monomers of less than 10 weight percent based on the total weight of the first epoxy component and having an epoxide equivalent weight in the range of 170 to 200; and ii) a second epoxy component comprising an epoxy resin having monomers with an average functionality of at least 2 and b) a hardener, are disclosed. The curable compositions can be used to prepare prepregs for hot-melt applications.

First claim

1 . A curable composition comprising:
a) an epoxy mixture comprising i) a first epoxy component comprising epoxy phenol novolac oligomers having a content of 2-functional monomers of less than 10 weight percent based on the total weight of the first epoxy and having an epoxide equivalent weight in the range of 170 to 200 ii) a second epoxy component comprising an epoxy resin having monomers with an average functionality of at least 2 wherein the first epoxy is present in the range of from 10 weight percent to 90 weight percent and the second epoxy is present in the range of from 0 weight percent to 97 weight percent, based on the total weight of the epoxy mixture; and b) a hardener.

2 . A curable composition in accordance with claim 1 wherein the first epoxy component comprises less than 5 weight percent of 2-functional monomers based on the total weight of the first epoxy component.

3 . A curable composition in accordance with claim 1 wherein the first epoxy component has an average functionality of from 4.0 to 5.0 epoxy groups per molecule.

4 . A curable composition in accordance with claim 1 wherein the first epoxy component has an average functionality of from 4.2 to 4.8 epoxy groups per molecule.

5 . A curable composition in accordance with claim 1 wherein the first epoxy component comprises less than 5 weight percent of 2-functional monomers, in the range of from 15 weight percent to 20 weight percent of 3-functional monomers, in the range of from 10 weight percent to 20 weight percent of 4-functional monomers, in the range of from 10 to 20 weight percent of 5-functional monomers, and in the range of from 50 weight percent to 60 weight percent of 6-functional monomers, based on the total weight of the first epoxy component.

6 . A curable composition in accordance with claim 1 wherein the hardener is selected from the group consisting of aliphatic amines, modified aliphatic amines, cycloaliphatic amines, modified cycloaliphatic amines, amidoamines, dicyanopolyamide, polyamide, tertiary amines, aromatic amines, anhydrides, mercaptans, cyclic amidines, isocyanate cyanate esters, phenolic hardeners and combinations thereof.

7 . A curable composition in accordance with claim 1 wherein the curable composition does not contain a solvent.

8 . A curable composition in accordance with claim 1 further comprising a catalyst.

9 . A curable composition in accordance with claim 1 having a complex shear modulus in the range of from 0.3 MPa to 0.03 MPa at conditions of under 25° C. and 1 rad/s and a glass transition temperature (T g ) that is equal to or greater than the final curing temperature when the prepreg is cured for less than two hours.

10 . A hot melt prepreg prepared from the curable composition of claim 1 .

Assignees

• Dow Global Technologies Llc

Inventors

• Liang yi ling
• Fan William W
• Moore Stanley E
• Xie Rui
• Wilson Mark B

Classifications

• C08G59/08

  from phenol-aldehyde condensates · CPC title

• C08J2363/04

  Epoxynovolacs · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/44

  Amides · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title