Halogen-free resin composition, and prepreg and laminate for printed circuits using same
US-2015353722-A1 · Dec 10, 2015 · US
Epoxy resin composition for resin transfer molding of fiber-reinforced composite material, fiber-reinforced composite material, and method for producing same
US9309352B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9309352-B2 |
| Application number | US-201213981113-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 20, 2012 |
| Priority date | Jan 27, 2011 |
| Publication date | Apr 12, 2016 |
| Grant date | Apr 12, 2016 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An epoxy resin composition for RTM molding of a fiber-reinforced composite material includes [A] to [D] below, wherein [A]/[B], which is a blend mass ratio of [A] to [B], is in the range of 55/45 to 95/5: [A] a multifunctional epoxy resin that is liquid at normal temperature or has a softening point of 65° C. or lower, the multifunctional epoxy resin being at least one selected from phenol novolac epoxy resin, cresol novolac epoxy resin, and triphenylmethane epoxy resin; [B] an alicyclic epoxy resin; [C] an acid anhydride curing agent; and [D] a curing accelerator.
First claim
Opening claim text (preview).
The invention claimed is: 1. A process of producing a fiber-reinforced composite material with the epoxy resin composition for Resin Transfer Molding (RTM) of a fiber-reinforced composite material comprising [A] to [D] below, wherein [A]/[B], which is a blend mass ratio of [A] to [B], is 55/45 to 95/5: [A] a multifunctional epoxy resin that is liquid at normal temperature or has a softening point of 65° C. or lower, the multifunctional epoxy resin being at least one selected from the group consisting of phenol novolac epoxy resin, cresol novolac epoxy resin, and triphenylmethane epoxy resin; [B] an alicyclic epoxy resin; [C] an acid anhydride curing agent; [D] an organophosphorus compound or an imidazole having a substitute in its 1-position, and a reinforcing fiber, comprising steps (i) and (ii): (i) performing RTM molding in a mold at 90 to 130° C. for 0.5 to 10 minutes and performing mold release after bringing a glass-transition temperature to 95 to 150° C. and a reaction rate to 50 to 90% to obtain a pre-molded product; and (ii) post-curing the obtained pre-molded product in a temperature range of 130 to 200° C. to obtain a fiber-reinforced composite material whose glass-transition temperature has been brought to 150 to 220° C. and reaction rate to 90 to 100%.
Assignees
Inventors
Classifications
Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof · CPC title
- C08G59/3218Primary
Carbocyclic compounds · CPC title
Epoxynovolacs · CPC title
Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title
Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9309352B2 cover?
- An epoxy resin composition for RTM molding of a fiber-reinforced composite material includes [A] to [D] below, wherein [A]/[B], which is a blend mass ratio of [A] to [B], is in the range of 55/45 to 95/5: [A] a multifunctional epoxy resin that is liquid at normal temperature or has a softening point of 65° C. or lower, the multifunctional epoxy resin being at least one selected from phenol novo…
- Who is the assignee on this patent?
- Oka Hideki, Tomioka Nobuyuki, Honda Shiro, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification C08G59/3218. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Apr 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).