Moisture-Curable Compositions Comprising Silane-Grafted Polyolefin Elastomer and Halogen-Free Retardant
US-2019309117-A1 · Oct 10, 2019 · US
Halogen free composition
Halogen free composition · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08L2201/22 |
| Official title | Halogen free composition |
| Display label | Halogen free composition |
| Total patents | 138 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 15 |
| 2017 | 21 |
| 2018 | 16 |
| 2019 | 17 |
| 2020 | 21 |
| 2021 | 4 |
| 2022 | 7 |
| 2023 | 14 |
| 2024 | 9 |
| 2025 | 6 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Halogen-free flame retardant compositions with improved tensile properties
US-2019031868-A1 · Jan 31, 2019 · US
Halogen-free Flame Retardant Resin Composition, Prepreg and Copper Clad Laminate Prepared Therefrom
US-2018371232-A1 · Dec 27, 2018 · US
Halogen free resin composition and prepreg and laminated board prepared therefrom
US-10144824-B2 · Dec 4, 2018 · US
Polyphenolic condensates and epoxy resins thereof
US-10138325-B2 · Nov 27, 2018 · US
Halogen-free resin composition and prepreg and laminate prepared therefrom
US-2018327558-A1 · Nov 15, 2018 · US
Thermoset resin composition, and prepreg and laminated board made of same
US-2018304604-A1 · Oct 25, 2018 · US
Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Using the Same
US-2018208765-A1 · Jul 26, 2018 · US
Insulated wire and cable using halogen-free flame-retardant resin composition
US-2018158571-A1 · Jun 7, 2018 · US
Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit boards using the same
US-2018126701-A1 · May 10, 2018 · US
Halogen-free resin composition, and a prepreg and a laminate used for printed circuit using the same
US-9963590-B2 · May 8, 2018 · US
Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same
US-2018086895-A1 · Mar 29, 2018 · US
Resin composition and resin molded object
US-9909005-B2 · Mar 6, 2018 · US
Resin composition, prepreg, and laminated sheet
US-9902825-B2 · Feb 27, 2018 · US
Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Prepared Using the Same
US-2018044467-A1 · Feb 15, 2018 · US
Actuator
US-9893442-B2 · Feb 13, 2018 · US
Halogen-free epoxy resin composition, prepreg and laminate using same
US-9873789-B2 · Jan 23, 2018 · US
Halogen-free flame-retardant polyolefin composite foam material and preparation method thereof
US-9856356-B2 · Jan 2, 2018 · US
Fiber structure having halogen-free foaming polymer layer
US-2017361588-A1 · Dec 21, 2017 · US
Halogen-free resin composition and uses thereof
US-9840620-B2 · Dec 12, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08L2201/22?
- CPC C08L2201/22 is the Cooperative Patent Classification code for “Halogen free composition.”
- How many patents are filed under CPC C08L2201/22 (Halogen free composition)?
- Our database includes 138 publications tagged with this CPC code.
- Is patent activity under CPC C08L2201/22 growing?
- Publication counts under this code: 9 in 2024 vs 6 in 2025 (latest complete years).