Halogen-free resin composition, and a prepreg and a laminate used for printed circuit using the same

Patent metadata

Field	Value
Publication number	US-9963590-B2
Application number	US-201415027374-A
Country	US
Kind code	B2
Filing date	Jun 10, 2014
Priority date	Jun 10, 2014
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

First claim

The invention claimed is:

1. A halogen-free resin composition, comprising:
(A) an alkyl phenol epoxy resin;
(B) a benzoxazine resin;
(C) an alkyl phenol novolac curing agent; and
(D) a phosphorus-containing flame retardant.

2. The halogen-free resin composition of claim 1 , wherein, based on 100 parts by weight of the organic solid matters, the addition amount of the alkyl phenol epoxy resin is about 10 to about 50 parts by weight.

3. The halogen-free resin composition of claim 1 , wherein the alkyl phenol epoxy resin has the following structure:

wherein, R 1 and R 2 are independently substituted or unsubstituted straight alkyl or branched alkyl having a carbon atom number of 4 to 8; and n is an integer between 2 and 20.

4. The halogen-free resin composition of claim 1 , wherein based on 100 parts by weight of the organic solid matters, the addition amount of the benzoxazine resin is about 10 to about 70 parts by weight.

5. The halogen-free resin composition of claim 1 , wherein the benzoxazine resin is any one of bisphenol-A benzoxazine resin, bisphenol-F benzoxazine resin, MDA benzoxazine resin, phenolphthalein benzoxazine resin or dicyclopentadiene benzoxazine resin, or a mixture of at least two thereof.

6. The halogen-free resin composition of claim 1 , wherein based on 100 parts by weight of the organic solid matters, the addition amount of the alkyl phenol novolac curing agent is about 5 to about 25 parts by weight.

7. The halogen-free resin composition of claim 1 , wherein the alkyl phenol novolac curing agent has the following structure:

wherein, R 3 , R 4 and R 5 are independently substituted or unsubstituted straight alkyl or branched alkyl having a carbon atom number of 4-8; and n 1 is an integer between 2 and 20.

8. The halogen-free resin composition of claim 1 , wherein based on 100 parts by weight of the total addition amount of component (A), component (B) and component (C), the addition amount of the phosphorus-containing flame retardant is about 5 to about 50 parts by weight.

9. The halogen-free resin composition of claim 1 wherein the phosphorus-containing flame retardant is any one of tri(2,6-dimethylphenyl)phosphine, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 2,6-bis(2,6-dimethylphenyl) phosphinobenzene or 10-phenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, phenoxy phosphazene compound, phosphate or polyphosphate, or a mixture of at least two or more thereof.

10. The halogen-free resin composition of claim 1 , wherein the halogen-free resin composition also comprises a curing accelerator, and based on 100 parts by weight of the total addition amount of component (A), component (B), component (C) and component (D), the addition amount of the curing accelerator is about 0.05 to about 1 parts by weight.

11. The halogen-free resin composition of claim 10 , wherein the curing accelerator is any one selected from the group consisting of imidazole or/and pyridine curing accelerators, or a mixture of at least two or more thereof; preferably any one selected from the group consisting of 2-methyl imidazole, 2-ethyl-4-methyl imidazole, 2-phenyl imidazole, 2-undecyl imidazole, triethylamine, benzyl dimethylamine or dimethylamino pyridine, or a mixture of at least two or more thereof.

12. The halogen-free resin composition of claim 1 , wherein the halogen-free resin composition also comprises a filler, and the filler is an organic filler, inorganic filler, or both.

13. The halogen-free resin composition of claim 12 , wherein based on 100 parts by weight of the total addition amount of component (A), component (B), component (C) and component (D), the addition amount of the filler is about 0 to about 100 parts by weight excluding 0.

14. The halogen-free resin composition of claim 12 , wherein the inorganic filler is any one selected from the group consisting of fused silicon dioxide, crystalline silicon dioxide, spherical silicon dioxide, hollow silicon dioxide, aluminum hydroxide, alumina, talcum powder, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica or glass fiber powder, or mixture of at least two or more thereof.

15. The halogen-free resin composition of claim 12 , wherein, the organic filler is any one selected from the group consisting of polytetrafluorethylene powder, polyphenylene sulfide or polyethersulfone powder, or a mixture of at least two or more thereof.

16. The halogen-free resin composition of claim 12 , wherein the filler is silicon dioxide, and the median of the particle diameter thereof is about 1 to about 15 μm.

17. A prepreg, comprising a reinforcing material and the halogen-free resin composition of claim 1 which is attached on the reinforcing material after impregnation and drying.

18. A laminate, wherein it comprises at least one sheet of the prepreg of claim 17 .

19. The halogen-free resin composition of claim 10 , characterized in that, the curing accelerator is any one selected from the group consisting of 2-methyl imidazole, 2-ethyl-4-methyl imidazole, 2-phenyl imidazole, 2-undecyl imidazole, triethylamine, benzyl dimethylamine or dimethylamino pyridine, or a mixture of at least two or more thereof.

Assignees

• Shengyi Technology Co Ltd

Inventors

• You Jiang

Classifications

• B32B2307/306

  Resistant to heat · CPC title

• C08J2479/02

  Polyamines · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• C08K5/0066

  Flame-proofing or flame-retarding additives · CPC title

• B32B27/38

  comprising epoxy resins · CPC title