Halogen-free epoxy resin composition, prepreg and laminate using same

Patent metadata

Field	Value
Publication number	US-9873789-B2
Application number	US-201515118204-A
Country	US
Kind code	B2
Filing date	Jun 1, 2015
Priority date	Dec 26, 2014
Publication date	Jan 23, 2018
Grant date	Jan 23, 2018

Abstract

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.

First claim

The invention claimed is:

1. A halogen-free epoxy resin composition, comprising
(A) a halogen-free epoxy resin;
(B) a crosslinking agent; and
(C) a phosphorous-containing novolac resin having the following structure

A and A 1 are both dependently

p, q, m and n represent the numbers of repeating units and are independently integers which are greater than or equal to 1;
X is 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or derivatives thereof;
R is selected from the group consisting of hydrogen, aliphatic functional groups or aromatic functional groups.

2. The halogen-free epoxy resin composition according to claim 1 , characterized in that the halogen-free epoxy resin is selected from the group consisting of biphenyl novolac epoxy resin, DCPD novolac epoxy resin, alkylene novolac epoxy resin, bisphenol A novolac epoxy resin, bisphenol F epoxy resin, bisphenol Z epoxy resin, bisphenol AP epoxy resin, bisphenol TMC epoxy resin, biphenyl-containing epoxy resin, tetramethyl biphenyl epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, triphenyl methane epoxy resin, tetraphenyl ethane epoxy resin, dicyclopentadiene-phenol addition reaction epoxy resin, phenol aralkyl epoxy resin, naphthol novolac epoxy resin, naphthol aralkyl epoxy resin, naphthol-phenol co-condensation novolac epoxy resin, naphthol-cresol co-condensation novolac epoxy resin, aromatic hydrocarbon formaldehyde resin-modified novolac epoxy resin, biphenyl-modified novolac epoxy resin or imide-modified epoxy resin, or a mixture of at least two selected therefrom.

3. The halogen-free epoxy resin composition according to claim 1 , characterized in that the halogen-free epoxy resin is selected from the group consisting of biphenyl novolac epoxy resin, DCPD novolac epoxy resin or bisphenol A novolac epoxy resin, or a mixture of at least two selected therefrom.

4. The halogen-free epoxy resin composition according to claim 1 , characterized in that the halogen-free epoxy resin is biphenyl novolac epoxy resin or/and DCPD novolac epoxy resin.

5. The halogen-free epoxy resin composition according to claim 1 , characterized in that the crosslinking agent is selected from the group consisting of active esters, anhydride compounds or novolac resins, or a mixture of at least two selected therefrom.

6. The halogen-free epoxy resin composition according to claim 1 , characterized in that the halogen-free epoxy resin composition further comprises cyanates or prepolymers thereof.

7. The halogen-free epoxy resin composition according to claim 6 , characterized in that based on the total addition amount of components (A), (B) and (C) which is 100 parts by weight, the cyanates or prepolymers thereof are added in an amount of from 20 to 40 parts by weight.

8. The halogen-free epoxy resin composition according to claim 1 , characterized in that the halogen-free epoxy resin composition further comprises a curing accelerator.

9. The halogen-free epoxy resin composition according to claim 8 , characterized in that based on the total addition amount of components (A), (B) and (C) which is 100 parts by weight, the curing accelerator is added in an amount of from 0.05 to 1 part by weight.

10. The halogen-free epoxy resin composition according to claim 8 , characterized in that the curing accelerator is selected from the group consisting of 4-dimethylaminopyridine, 2-methylimidazole, 2-methyl-4-ethylimidazole or 2-phenyl-imidazole, zinc isooctanoate, or a mixture of at least two selected therefrom.

11. The halogen-free epoxy resin composition according to claim 1 , characterized in that the halogen-free epoxy resin composition further comprises a flame retardant compound, the flame retardant compound is flame retardant salts.

12. The halogen-free epoxy resin composition according to claim 11 , characterized in that based on the total addition amount of components (A), (B) and (C) which is 100 parts by weight, the flame retardant compound is added in an amount of from 0 to 50 parts by weight, excluding 0.

13. The halogen-free epoxy resin composition according to claim 1 , characterized in that the halogen-free epoxy resin composition further comprises a filler, the filler is organic or/and inorganic fillers.

14. The halogen-free epoxy resin composition according to claim 13 , characterized in that based on the total addition amount of components (A), (B) and (C) which is 100 parts by weight, the filler is added in an amount of from 0 to 100 parts by weight, excluding 0.

15. The halogen-free epoxy resin composition according to claim 13 , characterized in that the inorganic filler is selected from the group consisting of molten silica, crystalline silica, spherical silica, hollow silica, aluminium hydroxide, alumina, talc, aluminium nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica or glass fiber powder, or a mixture of at least two selected therefrom.

16. The halogen-free epoxy resin composition according to claim 13 , characterized in that the organic filler is selected from the group consisting of polytetrafluoroethylene powder, polyphenylene sulfide or polyether sulfone powder, or a mixture of at least two selected therefrom.

17. The halogen-free epoxy resin composition according to claim 13 , characterized in that the filler is silica having a moderate particle size of from 1 to 15 μm.

18. A prepreg comprising a reinforcing material and the halogen-free epoxy resin composition according to claim 1 attached thereon after impregnation and drying.

19. A laminate comprising at least one prepreg according to claim 18 .

20. A printed circuit board comprising at least one prepreg according to claim 18 .

21. The halogen-free epoxy resin composition according to claim 1 , characterized in that the crosslinking agent is selected from the group consisting of active esters or anhydride compounds.

22. The halogen-free epoxy resin composition according to claim 1 , characterized in that the crosslinking agent is active esters.

23. The halogen-free epoxy resin composition according to claim 1 , characterized in that the crosslinking agent is selected from the group consisting of active esters having the following structures

X is phenyl or naphthyl; j is 0 or 1; k is 0 or 1; n represents the number of repeating unit which is 0.25-1.25.

24. The halogen-free epoxy resin composition according to claim 1 , characterized in that based on the addition amount of the halogen-free epoxy resin which is 100 parts by weight, the phosphorous-containing novolac resin is from 30 to 70 parts by weight; the crosslinking agent is from 27 to 58 parts by weight.

Assignees

• Shengyi Technology Co Ltd

Inventors

• Zeng Xianping
• He Liexiang

Classifications

• C08J2461/14

  Modified phenol-aldehyde condensates · CPC title

• C08L63/04 Primary

  Epoxynovolacs · CPC title

• C08L2205/05

  containing polymer components which can react with one another · CPC title

• C08G59/685

  Carboxylates · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title