Resin composition and resin molded object

US9909005B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9909005-B2
Application numberUS-201314420562-A
CountryUS
Kind codeB2
Filing dateJul 18, 2013
Priority dateAug 31, 2012
Publication dateMar 6, 2018
Grant dateMar 6, 2018

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products. The resin component includes a component A which is a polycarbonate resin, a component B including organic sulfonic acid or organic sulfonic acid metal salt, whose content is 0.05% or more and 2.0% or less by weight, a component C which is a drip inhibitor, whose content is 0.05% or more and 1.0% or less by weight, and a component D which is a silicone compound, whose content is 0.1% or more and 2.0% or less by weight. Among hydrogen atoms in the silicone compound and the proportion of hydrogen atoms in phenyl groups is 51% or more.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin composition that consists of: a component A which is a resin that is free of halogens; a component B which is an organic sulfonic acid or an organic sulfonic acid metal salt, the content of the component B being 0.05% or more and 2.0% or less by weight of the composition; a component C which is a drip inhibit or, the content of the component C being 0.05% or more and 1.0% or less by weight of the composition; a component D which is a silicone compound; and a component E which is talc, wherein, component A consists only of a polycarbonate resin or a mixture of polycarbonate resins, each polycarbonate resin in Component A has an average molecular weight in polystyrene equivalent of 36000 or more and 58000 or less as may be obtained by GPC (Gel Permeation Chromatography) measurement using a chloroform solvent and with a polystyrene molecular weight standard substance as a reference, among hydrogen atoms in component D, (a) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in methyl groups is 22% or more, or (b) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in hydrogen groups is 22% or more, or (c) a proportion of the hydrogen atoms in hydrogen groups is 22% or more and the proportion of the hydrogen atoms in methyl groups is 50% or more, and the content of the component D is 0.1% or more by weight and 2.0% or less by weight of the composition. 2. The resin composition according to claim 1 , wherein, among hydrogen atoms in component D, a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in methyl groups in component D is 29% or more. 3. The resin composition according to claim 1 , wherein the component D is a polyorganosiloxane. 4. The resin composition according to claim 1 , wherein the component E which is talc has particles with an average median diameter of 4.6 μm or more and 6.0 μm or less. 5. The resin composition according to claim 1 , wherein the component B is a sulfonic acid of a high molecular polymer having an aromatic ring or a sulfonic acid metal salt of a high molecular polymer having an aromatic ring. 6. The resin composition according to claim 1 , wherein the component C is a polytetrafluoroethylene having fibril-forming abilities. 7. A resin composition that consists of: a component A which is a resin that is free of halogens; a component B which is an organic sulfonic acid or an organic sulfonic acid metal salt; a component C which is a drip inhibitor; and a component D which is a silicone compound, wherein, component A consists only of a polycarbonate resin or a mixture of polycarbonate resins, each polycarbonate resin in Component A has an average molecular weight in polystyrene equivalent of 36000 or more and 58000 or less as may be obtained by GPC (Gel Permeation Chromatography) measurement using a chloroform solvent and with a polystyrene molecular weight standard substance as a reference, among hydrogen atoms in component D, (a) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in methyl groups is 22% or more, (b) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in hydrogen groups is 22% or more, or (c) a proportion of the hydrogen atoms in hydrogen groups is 22% or more and the proportion of the hydrogen atoms in methyl groups is 50% or more. 8. A resin molded object comprising a composition that consists of: a component A which is a resin that is free of halogens; a component B which is an organic sulfonic acid or an organic sulfonic acid metal salt, the content of the component B being 0.05% or more and 2.0% or less by weight of the composition; a component C which is a drip inhibitor, the content of the component C being 0.05% or more and 1.0% or less by weight of the composition; and a component D which is a silicone compound, wherein, component A consists only of a polycarbonate resin or a mixture of polycarbonate resins, each polycarbonate resin in Component A has an average molecular weight in polystyrene equivalent of 36000 or more and 58000 or less as may be obtained by GPC (Gel Permeation Chromatography) measurement using a chloroform solvent and with a polystyrene molecular weight standard substance as a reference, among hydrogen atoms in component D, (a) (a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in methyl groups is 22% or more, (b) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in hydrogen groups is 22% or more, or (c) a proportion of the hydrogen atoms in hydrogen groups is 22% or more and the proportion of the hydrogen atoms in methyl groups is 50% or more, and the content of the component D is 0.1% or more and 2.0% or less by weight of the composition. 9. A resin composition that consists of: a component A which is a polycarbonate resin that is free of halogens; a component B which is an organic sulfonic acid or an organic sulfonic acid metal salt; a component C which is a drip inhibitor; a component D which is a silicone compound; and a component E which is talc, wherein, component A consists only of a polycarbonate resin or a mixture of polycarbonate resins, each polycarbonate resin in Component A has an average molecular weight in polystyrene equivalent of 36000 or more and 58000 or less as may be obtained by GPC (Gel Permeation Chromatography) measurement using a chloroform solvent and with a polystyrene molecular weight standard substance as a reference, among hydrogen atoms in component D, (a) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in methyl groups is 22% or more, (b) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in hydrogen groups is 22% or more, or (c) a proportion of the hydrogen atoms in hydrogen groups is 22% or more and the proportion of the hydrogen atoms in methyl groups is 50% or more.

Assignees

Inventors

Classifications

  • C08L69/00Primary

    Compositions of polycarbonates; Compositions of derivatives of polycarbonates · CPC title

  • Sulfonic acids; Derivatives thereof · CPC title

  • Homopolymers or copolymers or tetrafluoroethene · CPC title

  • Flame or fire retardant/resistant · CPC title

  • Polysiloxanes · CPC title

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What does patent US9909005B2 cover?
A halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products. The resin component includes a component A which is a polycarbonate resin, a component B including organic sulfonic acid or organic sulfonic acid metal salt, whose content is 0.05% or more and 2…
Who is the assignee on this patent?
Sony Corp
What technology area does this patent fall under?
Primary CPC classification C08L69/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).