Halogen free resin composition and prepreg and laminated board prepared therefrom

Patent metadata

Field	Value
Publication number	US-10144824-B2
Application number	US-201415313669-A
Country	US
Kind code	B2
Filing date	Dec 2, 2014
Priority date	Nov 11, 2014
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.

First claim

The invention claimed is:

1. A halogen-free resin composition, comprising in parts by weight: from 50 to 100 parts of an epoxy resin, from 20 to 70 parts of benzoxazine, from 5 to 40 parts of a polyphenyl ether, from 5 to 40 parts of allylbenzene-maleic anhydride, from 10 to 60 parts of a halogen-free flame retardant, from 0.2 to 5 parts of a curing accelerator, and from 20 to 100 parts of a filler;
wherein the allylbenzene-maleic anhydride has the following chemical structural formula

wherein x is any one selected from the group consisting of 1-4, 6 and 8; n is any one selected from the group consisting of 1-12; both x and n are integers.

2. The halogen-free resin composition according to claim 1 , wherein the epoxy resin is any one selected from the group consisting of bisphenol-A epoxy resin, bisphenol-F epoxy resin, biphenyl epoxy resin, alkyl novolac epoxy resin, dicyclopentadiene epoxy resin, bisphenol-A novolac epoxy resin, o-cresol novolac epoxy resin, phenol novolac epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, isocyanate-modified epoxy resin, naphthalene epoxy resin and phosphorus-containing epoxy resin, or a mixture of at least two selected therefrom.

3. The halogen-free resin composition according to claim 1 , wherein the benzoxazine is any one selected from the group consisting of fluorinated benzoxazine resin, aliphatic benzoxazine resin and dicyclopentadiene benzoxazine resin, or a mixture of at least two selected therefrom.

4. The halogen-free resin composition according to claim 3 , wherein the fluorinated benzoxazine resin is any one selected from the group consisting of the following chemical structural formulae, or a mixture of at least two selected therefrom

5. The halogen-free resin composition according to claim 3 , wherein the aliphatic benzoxazine resin has the following chemical structural formula:

wherein n is 2 or 3.

6. The halogen-free resin composition according to claim 3 , wherein the dicyclopentadiene benzoxazine resin has the following chemical structural formula:

7. The halogen-free resin composition according to claim 1 , wherein the polyphenyl ether has a number average molecular weight of 1000-4000.

8. The halogen-free resin composition according to claim 1 , wherein the halogen-free flame retardant is any one selected form the group consisting of phosphazene, ammonium polyphosphate, tris(2-carboxyethyl)phosphine, tri(isopropylchloro)phosphate, trimethyl phosphate, dimethyl-methyl phosphate, resorcinol bis-xylyl phosphate, phosphorus-nitrogen compounds, melamine polyphosphate, melamine cyanurate, tri-hydroxyethyl isocyanurate, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and DOPO-containing novolac resin, or a mixture of at least two selected therefrom.

9. The halogen-free resin composition according to claim 1 , wherein the curing accelerator is imidazole accelerator.

10. The halogen-free resin composition according to claim 9 , wherein the curing accelerator is any one selected from the group consisting of 2-methylimidazole, undecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole and 1-cyanoethyl-substituted imidazole, or a mixture of at least two selected therefrom.

11. The halogen-free resin composition according to claim 1 , wherein the filler is an organic or inorganic filler.

12. The halogen-free resin composition according to claim 11 , wherein the filler is an inorganic filler selected from the group consisting of aluminum hydroxide, alumina, magnesium hydroxide, magnesium oxide, aluminum oxide, silica, calcium carbonate, aluminum nitride, boron nitride, silicon carbide, titanium dioxide, zinc oxide, zirconium oxide, mica, boehmite, calcined talc, talcum powder, silicon nitride and calcined kaolin, or a mixture of at least two selected therefrom.

13. The halogen-free resin composition according to claim 11 , wherein the filler is an organic filler selected from the group consisting of polytetrafluoroethylene powder, polyphenylene sulfide and polyether sulfone powder, or a mixture of at least two selected therefrom.

14. The halogen-free resin composition according to claim 11 , wherein the filler has a particle size of from 0.01 to 50 μm.

15. A prepreg prepared from the halogen-free resin composition according to claim 1 , wherein the prepreg comprises a matrix material, and the halogen-free resin composition attached thereon after impregnation and drying.

16. A laminate, comprising the prepreg according to claim 15 .

17. A printed circuit board, comprising the laminate according to claim 16 .

18. The prepreg according to claim 15 , wherein the matrix material is a non-woven or woven glass fiber cloth.

19. The halogen-free resin composition according to claim 1 , wherein the benzoxazine is any one selected from the group consisting of fluorinated benzoxazine resin and aliphatic benzoxazine resin, or a mixture of at least two selected therefrom.

Assignees

• Shengyi Technology Co Ltd

Inventors

• Li Hui
• Fang Kehong

Classifications

• C08L2201/22

  Halogen free composition · CPC title

• C08L35/06

  Copolymers with vinyl aromatic monomers · CPC title

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C08K5/49

  Phosphorus-containing compounds {(C08K5/0091 takes precedence)} · CPC title

• C08K5/3445

  Five-membered rings · CPC title