Resin composition, prepreg and laminate board
US-2016369042-A1 · Dec 22, 2016 · US
Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/42 |
| Official title | Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof |
| Display label | Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof |
| Total patents | 458 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 35 |
| 2016 | 53 |
| 2017 | 49 |
| 2018 | 34 |
| 2019 | 53 |
| 2020 | 46 |
| 2021 | 40 |
| 2022 | 35 |
| 2023 | 36 |
| 2024 | 30 |
| 2025 | 43 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process
US-9504168-B2 · Nov 22, 2016 · US
Epoxy resin composition for transparent sheets and cured product thereof
US-9493630-B2 · Nov 15, 2016 · US
Epoxy resin composition for transparent sheets and cured product thereof
US-9493631-B2 · Nov 15, 2016 · US
Oxazolidone ring containing adducts
US-9481757-B2 · Nov 1, 2016 · US
Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
US-2016314992-A1 · Oct 27, 2016 · US
Curable epoxy composition, film, laminated film, prepreg, laminate, cured article, and composite
US-2016297921-A1 · Oct 13, 2016 · US
Resin composition, hardened coating films therefrom, and photosemiconductor device using same
US-9464186-B2 · Oct 11, 2016 · US
Curable compositions which form interpenetrating polymer networks
US-2016280907-A1 · Sep 29, 2016 · US
Epoxy resin curing agents, epoxy resin compositions, epoxy resin cured products, and methods of producing epoxy resin curing agent
US-2016280845-A1 · Sep 29, 2016 · US
Underfill material and method for manufacturing semiconductor device by using the same
US-9437462-B2 · Sep 6, 2016 · US
White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the optical semiconductor element
US-2016244604-A1 · Aug 25, 2016 · US
Graphene polymer conductive film and method of manufacturing the same
US-2016244577-A1 · Aug 25, 2016 · US
Methods for producing thermosetting epoxy resins
US-9416218-B2 · Aug 16, 2016 · US
Negative photosensitive resin composition and cured product of same
US-9411229-B2 · Aug 9, 2016 · US
Fluorine-containing self-lubricating fabric coating material and method for preparing the same
US-2016208431-A1 · Jul 21, 2016 · US
Epoxy elastomer compositions
US-9371416-B2 · Jun 21, 2016 · US
Epoxy resin-based composition as a filler honeycomb cells
US-2016160039-A1 · Jun 9, 2016 · US
Vegetable oil-based pressure sensitive adhesives
US-9315704-B2 · Apr 19, 2016 · US
Conductive resin composition and multilayer ceramic capacitor having the same
US-2016104552-A1 · Apr 14, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/42?
- CPC C08G59/42 is the Cooperative Patent Classification code for “Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof.”
- How many patents are filed under CPC C08G59/42 (Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof)?
- Our database includes 458 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/42 growing?
- Publication counts under this code: 30 in 2024 vs 43 in 2025 (latest complete years).