No flow underfill or wafer level underfill and solder columns
US-8963340-B2 · Feb 24, 2015 · US
Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process
US9504168B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9504168-B2 |
| Application number | US-201113994674-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 30, 2011 |
| Priority date | Sep 30, 2011 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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Abstract
Official abstract text for this publication.
A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
First claim
Opening claim text (preview).
What is claimed is: 1. A method comprising: dispensing a fluxing-encapsulant material onto a bottom substrate which is secured to a pedestal; placing a top substrate onto the bottom substrate with a bond force, the top substrate secured to a bond head; ramping the bond head temperature to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second; maintaining the bond head temperature between 250° C.-300° C. for a period of time, wherein the fluxing-encapsulant material…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9504168B2 cover?
- A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curi…
- Who is the assignee on this patent?
- Nagarajan Sivakumar, Razdan Sandeep, Ananthakrishnan Nisha, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H05K3/3489. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).