Resin composition, prepreg and laminate board

Patent metadata

Field	Value
Publication number	US-2016369042-A1
Application number	US-201414901996-A
Country	US
Kind code	A1
Filing date	Jun 24, 2014
Priority date	Jul 4, 2013
Publication date	Dec 22, 2016
Grant date	—

Abstract

A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.

First claim

1 . A resin composition comprising:
a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more; and a second curing agent being a different compound from the monofunctional acid anhydride.

2 . The resin composition according to claim 1 , wherein
the second curing agent is at least one selected from the group consisting of a polyfunctional acid anhydride, a styrene-maleic anhydride resin, an amine-based curing agent, a thiol-based curing agent, a cyanate-based curing agent, an active ester-based curing agent, and a phenol-based curing agent.

3 . The resin composition according to claim 1 , further comprising:
a phosphorus-containing flame retardant, wherein a phosphorus content of a total amount of an organic component and the phosphorus-containing flame retardant in the resin composition is 1.0 mass % or more, and at least a portion of the phosphorus-containing flame retardant has a functional group reactive with an acid anhydride group or a carboxy group.

4 . The resin composition according to claim 1 , further comprising:
an inorganic filler, wherein a content of the inorganic filler is 5 to 50 parts by mass with respect to 100 parts by mass of a remaining portion of the resin composition that excludes the inorganic filler.

5 . The resin composition according to claim 4 , wherein
a surface treatment is performed on the inorganic filler with a silane coupling agent.

6 . The resin composition according to claim 4 , further comprising:
1 to 10 parts by mass of a silane coupling agent with respect to 100 parts by mass of the inorganic filler.

7 . A prepreg formed through impregnating a base material with the resin composition according to claim 1 , and semi-curing the resin composition.

8 . A laminate board formed through laminating the prepreg according to claim 7 with a metal foil, and hot-press molding the laminated prepreg.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Nii Daisuke
• Nishino Mitsuyoshi
• Sato Fuminori
• Nakamura Yoshihiko

Classifications

• C08K9/06

  with silicon-containing compounds · CPC title

• B32B15/08

  of synthetic resin · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• B32B27/38

  comprising epoxy resins · CPC title

• C08J5/24

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title