White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the optical semiconductor element

Patent metadata

Field	Value
Publication number	US-2016244604-A1
Application number	US-201615044347-A
Country	US
Kind code	A1
Filing date	Feb 16, 2016
Priority date	Feb 20, 2015
Publication date	Aug 25, 2016
Grant date	—

Abstract

Provided are a white heat-curable epoxy resin composition having a high strength, high toughness and superior heat resistance; and a semiconductor device whose light receiving and other semiconductor elements are encapsulated by a cured product of such composition. The composition includes:
(A) a prepolymer obtained by heating, melting and mixing components (A-1) triazine derivative epoxy resin, (A-2) acid anhydride and (A-3) acrylic block copolymer so as to react them at an epoxy group equivalent in the component (A-1)/acid anhydride group equivalent of the component (A-2) ratio of 0.6 to 2.0; (B) a white pigment including at least a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

First claim

What is claimed:

1 . A white heat-curable epoxy resin composition comprising:
(A) a prepolymer obtained by a reaction of components (A-1), (A-2) and (A-3) at an epoxy group equivalent in the component (A-1)/acid anhydride group equivalent of the component (A-2) ratio of 0.6 to 2.0, the component (A-1) being a triazine derivative epoxy resin, the component (A-2) being an acid anhydride, and the component (A-3) being an acrylic block copolymer and added in an amount of 2 to 20 parts by mass with respect to 100 parts by mass of a total sum of the components (A-1) and (A-2); (B) a white pigment including at least a titanium oxide, the white pigment being in an amount of 3 to 350 parts by mass with respect to the total sum of the components (A-1) and (A-2); (C) an inorganic filler being in an amount of 80 to 600 parts by mass with respect to 100 parts by mass of the total sum of the components (A-1) and (A-2); (D) a curing accelerator being in an amount of 0.05 to 5 parts by mass with respect to the total sum of the components (A-1) and (A-2); and (E) an antioxidant being in an amount of 0.01 to 10 parts by mass with respect to the total sum of the components (A-1) and (A-2).

2 . The white heat-curable epoxy resin composition according to claim 1 , wherein the titanium oxide of the component (B) is surface treated.

3 . The white heat-curable epoxy resin composition according to claim 2 , wherein the titanium oxide is surface treated with at least one of a silica, an alumina, a polyol and an organosilicon compound.

4 . The white heat-curable epoxy resin composition according to claim 1 , wherein the triazine derivative epoxy resin of the component (A-1) is 1,3,5-triazine derivative epoxy resin.

5 . An optical semiconductor element case made of the white heat-curable epoxy resin composition according to claim 1 .

6 . An optical semiconductor device comprised of the optical semiconductor element case according to claim 5 .

Assignees

• Shinetsu Chemical Co

Inventors

• Tsutsumi Yoshihiro
• Tomita Tadashi

Classifications

• C08L63/06

  Triglycidylisocyanurates · CPC title

• C08L2201/08

  Stabilised against heat, light or radiation or oxydation · CPC title

• C08L33/06

  of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/3245

  containing only nitrogen as a heteroatom · CPC title