Underfill material and method for manufacturing semiconductor device by using the same

Patent metadata

Field	Value
Publication number	US-9437462-B2
Application number	US-201414547660-A
Country	US
Kind code	B2
Filing date	Nov 19, 2014
Priority date	Feb 24, 2012
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

A method for manufacturing a semiconductor device by using underfill material includes: a semiconductor chip mounting step configured to mount a semiconductor chip having a solder bump on a substrate via an underfill film including a film forming resin having a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, an epoxy resin, and an epoxy curing agent; and a reflow step configured to solder-bond the semiconductor chip and the substrate by a reflow furnace. The film forming resin of the underfill material has a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, and accordingly, the viscosity at the time of heat melting can be reduced, and a semiconductor chip can be mounted at a low pressure.

First claim

What is claimed is:

1. A method of manufacturing a semiconductor device comprising:
a semiconductor chip mounting step configured to mount a semiconductor chip having a solder bump on a substrate via an underfill film including a film forming resin having a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, an epoxy resin, and an epoxy curing agent, wherein the film forming resin is a tri-block copolymer of p-hydroxystyrene and ethyl vinyl ether; and
a reflow step configured to solder-bond the above-mentioned semiconductor chip and the above-mentioned substrate by a reflow furnace.

2. An underfill material, comprising:
a film forming resin having a weight average molecular weight of not more than 30000 g/mol, and a molecular weight distribution of not more than 2.0;
an epoxy resin; and
an epoxy curing agent;
wherein the film forming resin is a tri-block copolymer of p-hydroxystyrene and ethyl vinyl ether.

3. The underfill material according to claim 2 , wherein the epoxy curing agent is an acid anhydride.

4. The underfill material according to claim 2 , wherein
a composition ratio of the p-hydroxystyrene to the ethyl vinyl ether (p-hydroxystyrene/ethyl vinyl ether) is not less than 20/80 and not more than 70/30, and
not less than 15 parts by mass and not more than 90 parts by mass of the epoxy curing agent with respect to 100 parts by mass of epoxy resin are blended.

5. The underfill material according to claim 2 , wherein
a composition ratio of the p-hydroxystyrene to the ethyl vinyl ether (p-hydroxystyrene/ethyl vinyl ether) is not less than 30/70 and not more than 50/50, and
not less than 40 parts by mass and not more than 70 parts by mass of the epoxy curing agent with respect to 100 parts by mass of epoxy resin are blended.

Assignees

• Dexerials Corp

Inventors

• Koyama Taichi

Classifications

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/016

  of strap connectors · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title