Curable composition and cured product of the same, and wafer-level lens
US-2024059831-A1 · Feb 22, 2024 · US
together with di-epoxy compounds
together with di-epoxy compounds · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/38 |
| Official title | together with di-epoxy compounds |
| Display label | together with di-epoxy compounds |
| Total patents | 364 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 28 |
| 2016 | 28 |
| 2017 | 26 |
| 2018 | 21 |
| 2019 | 34 |
| 2020 | 36 |
| 2021 | 51 |
| 2022 | 34 |
| 2023 | 23 |
| 2024 | 38 |
| 2025 | 37 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Epoxy resin curing compositions and epoxy resin systems including same
US-9840588-B2 · Dec 12, 2017 · US
Epoxy resin composition and fiber reinforced composite material
US-2017327652-A1 · Nov 16, 2017 · US
Thermally expandable preparations
US-9790341-B2 · Oct 17, 2017 · US
Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
US-9528026-B2 · Dec 27, 2016 · US
Resin composition, prepreg, and laminate
US-9512329-B2 · Dec 6, 2016 · US
Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process
US-9504168-B2 · Nov 22, 2016 · US
Photosensitive resin composition for optical waveguide, photocurable film for formation of optical waveguide core layer, optical waveguide produced by using the resin composition or the photocurable film, and hybrid flexible printed wiring board for optical/electrical transmission
US-2016326298-A1 · Nov 10, 2016 · US
Oxazolidone ring containing adducts
US-9481757-B2 · Nov 1, 2016 · US
Curable composition for lens, lens and optical device
US-2016311968-A1 · Oct 27, 2016 · US
Curable epoxy composition, film, laminated film, prepreg, laminate, cured article, and composite
US-2016297921-A1 · Oct 13, 2016 · US
Flexible wiring board and use thereof
US-2016295686-A1 · Oct 6, 2016 · US
Flexible underfill compositions for enhanced reliability
US-9458283-B2 · Oct 4, 2016 · US
Photosensitive resin composition, resist laminate, and articles obtained by curing same (7)
US-9448479-B2 · Sep 20, 2016 · US
Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same
US-9441104-B2 · Sep 13, 2016 · US
Optical waveguide photosensitive resin composition, photocurable film for forming optical waveguide core layer, optical waveguide using same, and mixed flexible printed circuit board for optical/electrical transmission
US-2016252655-A1 · Sep 1, 2016 · US
Semiconductor device and production method therefor
US-9425120-B2 · Aug 23, 2016 · US
Two-pack epoxy resin composition for fiber-reinforced composite materials, and fiber-reinforced composite material
US-2016237273-A1 · Aug 18, 2016 · US
Liquid underfill material composition for sealing semiconductor and flip-chip semiconductor device
US-2016186024-A1 · Jun 30, 2016 · US
Epoxy-based resin composition for composite materials
US-2016168372-A1 · Jun 16, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/38?
- CPC C08G59/38 is the Cooperative Patent Classification code for “together with di-epoxy compounds.”
- How many patents are filed under CPC C08G59/38 (together with di-epoxy compounds)?
- Our database includes 364 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/38 growing?
- Publication counts under this code: 38 in 2024 vs 37 in 2025 (latest complete years).