Photosensitive resin composition, resist laminate, and articles obtained by curing same (7)

Patent metadata

Field	Value
Publication number	US-9448479-B2
Application number	US-201314443679-A
Country	US
Kind code	B2
Filing date	Nov 21, 2013
Priority date	Nov 22, 2012
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.

First claim

The invention claimed is:

1. A photosensitive resin composition comprising: an epoxy resin (A), a polyhydric phenol compound (B), a cationic photopolymerization initiator (C), an epoxy group-containing silane compound (D), and a reactive epoxy monomer (E);
the epoxy resin (A) comprising an epoxy resin (a) produced from reaction of a phenol derivative represented by the following Formula (1) and epihalohydrin:

and an epoxy resin (b) represented by the following Formula (2):

wherein m is an average value, representing a real number in the range from 2 to 30, R 1 and R 2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a trifluoromethyl group, X each independently represents a hydrogen atom or a glycidyl group, and at least one of a plurality of X present is a glycidyl group;
the polyhydric phenol compound (B) comprising at least one selected from the group consisting of phenol compounds represented by the following Formulas (3) to (6):

wherein p is an average value, representing a real number in the range from 1 to 10, and R each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms,

wherein q is an average value, representing a real number in the range from 1 to 10,

wherein z is an average value, representing a real number in the range from 1 to 10,

wherein y is an average value, representing a real number in the range from 1 to 10, R 8 and R 9 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and
the reactive epoxy monomer (E) comprising a bisphenol epoxy resin.

2. The photosensitive resin composition according to claim 1 , wherein the reactive epoxy monomer (E) comprises a bisphenol-F epoxy resin and/or a bisphenol-A epoxy resin.

3. The photosensitive resin composition according to claim 1 , wherein a blending ratio of the reactive epoxy monomer (E) is 2 to 12 mass % relative to a total mass of the epoxy resin (A) and the polyhydric phenol compound (B).

4. The photosensitive resin composition according to claim 1 , wherein a blending ratio of the polyhydric phenol compound (B) is 1 to 40 mass % relative to a mass of the epoxy resin (A).

5. The photosensitive resin composition according to claim 1 , wherein a blending ratio of the cationic photopolymerization initiator (C) is 0.1 to 15 mass % relative to a total mass of the epoxy resin (A) and the polyhydric phenol compound (B).

6. The photosensitive resin composition according to claim 1 , wherein the epoxy group-containing silane compound (D) is an epoxy group-containing alkoxysilane compound.

7. The photosensitive resin composition according to claim 1 , wherein a blending ratio of the epoxy group-containing silane compound (D) is 1 to 15 mass % relative to a total mass of the epoxy resin (A), the polyhydric phenol compound (B), the cationic photopolymerization initiator (C), and the reactive epoxy monomer (E).

8. The photosensitive resin composition according to claim 1 , further comprising an acrylic resin (G).

9. The photosensitive resin composition according to claim 8 , wherein the acrylic resin (G) is a copolymer obtained by using an ethylenically unsaturated monomer having a glycidyl group.

10. The photosensitive resin composition according to claim 8 , wherein a blending ratio of the acrylic resin (G) is 1 to 20 mass % relative to a total mass of the epoxy resin (A), the polyhydric phenol compound (B), the cationic photopolymerization initiator (C), the epoxy group-containing silane compound (D), and the reactive epoxy monomer (E).

11. The photosensitive resin composition according to claim 1 , further comprising a solvent (F).

12. The photosensitive resin composition according to claim 11 , wherein a blending ratio of the solvent (F) is 5 to 95 mass % relative to a total mass of the photosensitive resin composition including the solvent (F).

13. A cured product of the photosensitive resin composition according to any one of claims 1 to 12 .

14. A resist laminate comprising the photosensitive resin composition according to any one of claims 1 to 12 sandwiched between two substrates.

15. A cured product of a dry film resist obtained from the resist laminate according to claim 14 .

Assignees

• Nippon Kayaku Kk

Inventors

• Imaizumi Naoko
• Inagaki Shinya
• Honda Nao

Classifications

• G03F7/0755 Primary

  Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds (G03F7/0752 takes precedence) · CPC title

• G03F7/038

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

• C08G59/62

  Alcohols or phenols · CPC title

• C08G59/32

  Epoxy compounds containing three or more epoxy groups · CPC title

• G03F7/0751

  used as adhesion-promoting additives or as means to improve adhesion · CPC title