Thermally expandable preparations

US9790341B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9790341-B2
Application numberUS-201414491034-A
CountryUS
Kind codeB2
Filing dateSep 19, 2014
Priority dateMar 29, 2012
Publication dateOct 17, 2017
Grant dateOct 17, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.

First claim

Opening claim text (preview).

The invention claimed is: 1. A thermally expandable preparation pumpable at application temperatures below 70° C., comprising (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity at 25° C. of at most 1250 Pa*s, (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity at 25° C. of at most 250 Pa*s, (c) at least one thermally activatable hardener, (d) at least one thermally activatable blowing agent, (e) at least 1 wt. % organic fibers having a fiber length from 0.2 mm to 10 mm, and (f) at least 20 wt. % fillers. 2. The preparation according to claim 1 , characterized in that it contains at least 30 wt. % fillers, based in each case on the total application preparation. 3. The preparation according to claim 1 , characterized in that the at least one filler is a lightweight filler. 4. The preparation according to claim 1 , characterized in that the at least one filler is an inorganic filler. 5. The preparation according to claim 1 , characterized in that the at least one filler is surface-treated silicon dioxide. 6. The preparation according to claim 1 , characterized in that it contains less than 1.5 wt. %, based on the total application preparation, of an epoxy resin that is solid at 25° C. 7. The preparation according to claim 1 , characterized in that the first epoxy resin E1 has an epoxy equivalent weight of at most 200 g/eq, and/or has a viscosity at 25° C. of at most 20 Pa*s, and/or is contained in the preparation in a quantity from 10 to 55 wt. %, based on the total application preparation. 8. The preparation according to claim 1 , characterized in that the second epoxy resin E2 has an epoxy equivalent weight of at least 400 g/eq, and/or has a viscosity at 25° C. of at most 200 Pa*s, and/or is contained in the preparation in a quantity from 5 to 35 wt. %, based on the total application preparation. 9. The preparation according to claim 1 , characterized in that it contains at least one impact modifier and/or at least one flame retardant. 10. A method for stiffening and/or reinforcing components having thin-walled structures, in particular tubular structures, characterized in that a thermally expandable preparation pumpable at application temperatures below 70° C. according to one of claims 1 to 9 is applied at a temperature below 70° C., at a pump pressure of less than 200 bar, onto the surface of the structure to be reinforced, and said preparation is cured at a later point in time at temperatures above 130° C. 11. A component having a thin-walled structure, which component has been stiffened and/or reinforced with a thermally expandable preparation pumbable at application temperatures below 70° C. according to one of claims 1 to 9 , in the cured state. 12. The preparation according to claim 1 , characterized in that the filler is hollow glass spheres. 13. The preparation according to claim 1 , characterized in that the filler is chalk.

Assignees

Inventors

Classifications

  • C08J9/0085Primary

    Use of fibrous compounding ingredients (C08J9/0076 takes precedence) · CPC title

  • Fibres or whiskers · CPC title

  • characterized by the use of several polymeric components · CPC title

  • Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

  • Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

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Frequently asked questions

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What does patent US9790341B2 cover?
The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and…
Who is the assignee on this patent?
Henkel Ag & Co Kgaa
What technology area does this patent fall under?
Primary CPC classification C08J9/0085. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 17 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).