Flexible underfill compositions for enhanced reliability

Patent metadata

Field	Value
Publication number	US-9458283-B2
Application number	US-201514746750-A
Country	US
Kind code	B2
Filing date	Jun 22, 2015
Priority date	Sep 24, 2010
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.

First claim

What is claimed is:

1. An underfill composition comprising:
an epoxy mixture comprising a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy; the first, second, and third epoxies each having a different chemical structure;
wherein the silicone epoxy has the following structure:

where R is a group selected from the group consisting of methyl groups and ethyl groups, and
where at least one of the R sites includes a methyl group and at least one of the R sites includes an ethyl group.

2. The underfill composition of claim 1 , wherein the bisphenol epoxy comprises a bisphenol F epoxy.

3. The underfill composition of claim 1 , further comprising a hardener component.

4. The underfill composition of claim 1 , further comprising a filler material.

5. The underfill composition of claim 4 , wherein the filler material comprises an oxide.

6. The underfill composition of claim 4 , wherein the filler material comprises SiO 2 present in an amount in the range of 50 to 70 weight percent of the underfill composition.

7. An assembly including the underfill composition of claim 1 , the assembly further including a die electrically coupled to a substrate through a solder material, and a gap between the die and the substrate, wherein the underfill composition is positioned in the gap.

8. The underfill composition of claim 1 , wherein a plurality of the R sites include a methyl group and a plurality of the R sites include an ethyl group.

9. The underfill composition of claim 8 , wherein the bisphenol epoxy comprises a bisphenol F epoxy.

10. The underfill composition of claim 8 , further including a filler, the filler present in an amount in the range of 50 to 70 weight percent of the underfill composition.

11. An assembly including the underfill composition of claim 8 , the assembly further including a die electrically coupled to a substrate through a solder material, and a gap between the die and the substrate, wherein the underfill composition is positioned in the gap.

12. An underfill composition comprising:
an epoxy mixture comprising a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy; the first, second, and third epoxies each having a different chemical structure;
wherein the silicone epoxy has the following structure:

where R is a group selected from the group consisting of methyl groups and ethyl groups.

13. The underfill composition of claim 12 , wherein the bisphenol epoxy comprises a bisphenol F epoxy.

14. The underfill composition of claim 12 , further comprising a hardener component.

15. The underfill composition of claim 12 , further comprising a filler material.

16. The underfill composition of claim 15 , wherein the filler material comprises SiO 2 present in an amount in the range of 50 to 70 weight percent of the underfill composition.

17. An assembly including the underfill composition of claim 12 , the assembly further including a die electrically coupled to a substrate through a solder material, and a gap between the die and the substrate, wherein the underfill composition is positioned in the gap.

18. The assembly of claim 17 , wherein the underfill composition is in direct contact with the substrate.

19. The underfill composition of claim 12 , wherein at least one of the R sites includes a methyl group and at least one of the R sites includes an ethyl group.

20. The underfill composition of claim 12 , wherein a plurality of the R sites include a methyl group and a plurality of the R sites include an ethyl group.

Assignees

• Intel Corp

Inventors

• Xu Dingying
• Ananthakrishnan Nisha
• Dong Hong
• Manepalli Rahul N
• Raravikar Nachiket R
• Constable Gregory S

Classifications

• C08L23/0884

  Epoxide-containing esters · CPC title

• Y10T428/31515

  As intermediate layer · CPC title

• C07F7/0838

  Compounds with one or more Si-O-Si sequences (compounds with a ring containing only alternating Si and O atoms, i.e. cyclosilanes C07F7/21) · CPC title

• C08G59/3254

  containing atoms other than carbon, hydrogen, oxygen or nitrogen · CPC title

• C08G59/02 Primary

  Polycondensates containing more than one epoxy group per molecule · CPC title