Monomer for optical component, polymerizable composition for optical component, cured product, spectacle lens, and method for producing monomer for optical component
US-2024336589-A1 · Oct 10, 2024 · US
Polycondensates modified by chemical after-treatment
Polycondensates modified by chemical after-treatment · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/14 |
| Official title | Polycondensates modified by chemical after-treatment |
| Display label | Polycondensates modified by chemical after-treatment |
| Total patents | 120 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 5 |
| 2017 | 7 |
| 2018 | 6 |
| 2019 | 9 |
| 2020 | 13 |
| 2021 | 9 |
| 2022 | 11 |
| 2023 | 12 |
| 2024 | 20 |
| 2025 | 14 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Curable resin composition and adhesive for bonding structural material using composition
US-11208579-B2 · Dec 28, 2021 · US
Curable resin composition
US-2021380749-A1 · Dec 9, 2021 · US
Adhesive Composition
US-2021284885-A1 · Sep 16, 2021 · US
Curable resin composition, cured product, and sheet-like formed body
US-2021221998-A1 · Jul 22, 2021 · US
Method for degradating thermosetting resin, catalyst composition used therein and resin composition obtained thereby
US-2021189057-A1 · Jun 24, 2021 · US
Resin sheet and cured product of resin sheet
US-10988585-B2 · Apr 27, 2021 · US
Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
US-2020392282-A1 · Dec 17, 2020 · US
Heat-curable resin composition, heat-curable resin film and semiconductor device
US-10865304-B2 · Dec 15, 2020 · US
Solid-solid phase-change materials
US-2020377646-A1 · Dec 3, 2020 · US
Epoxy resin emulsions for electrocoating
US-2020377740-A1 · Dec 3, 2020 · US
Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
US-2020347194-A1 · Nov 5, 2020 · US
Degradable silyl-containing thermosetting networks
US-2020332054-A1 · Oct 22, 2020 · US
Thermosetting resin composition
US-10774237-B2 · Sep 15, 2020 · US
Resin sheet and cured product of resin sheet
US-2020223994-A1 · Jul 16, 2020 · US
Photosensitive resin composition, photosensitive, sheet, semiconductor device and method for manufacturing semiconductor device
US-10705425-B2 · Jul 7, 2020 · US
Resist underlying film forming composition
US-2020209753-A1 · Jul 2, 2020 · US
Two-component mortar compound and use thereof
US-10633286-B2 · Apr 28, 2020 · US
Heat-curable resin composition, heat-curable resin film and semiconductor device
US-2020079954-A1 · Mar 12, 2020 · US
Epoxy resin composition, prepreg for fiber-reinforced composite material, and fiber-reinforced composite material
US-10577455-B2 · Mar 3, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/14?
- CPC C08G59/14 is the Cooperative Patent Classification code for “Polycondensates modified by chemical after-treatment.”
- How many patents are filed under CPC C08G59/14 (Polycondensates modified by chemical after-treatment)?
- Our database includes 120 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/14 growing?
- Publication counts under this code: 20 in 2024 vs 14 in 2025 (latest complete years).