Thermosetting resin composition

Patent metadata

Field	Value
Publication number	US-10774237-B2
Application number	US-201615767707-A
Country	US
Kind code	B2
Filing date	Sep 23, 2016
Priority date	Oct 13, 2015
Publication date	Sep 15, 2020
Grant date	Sep 15, 2020

Abstract

A thermosetting resin composition, a thermosetting resin composition for protective films, a thermosetting resin composition for planarizing films, and a method for producing a cured film, a protective film, or a planarizing film by using the resin composition. A thermosetting resin composition has a polymer having a structural unit of Formula (1) below, a curing agent in an amount of 0% by mass to 30% by mass with respect to the polymer, and a solvent. When the thermosetting resin composition includes the curing agent, the curing agent is at least one compound selected from polyfunctional (meth)acrylate compounds and polyfunctional blocked isocyanate compounds:

(wherein A 1 is a C 2 or C 3 alkenyl group or alkynyl group, and A 2 is a C 2 alkenylene group or alkynylene group).

First claim

The invention claimed is:

1. A thermosetting resin composition, comprising:
a polymer having a structural unit of Formula (1):

wherein A 1 is a C 2 or C 3 alkenyl group or alkynyl group, and A 2 is a C 2 alkenylene group or alkynylene group;
a curing agent in an amount of greater than 0% by mass and up to 30% by mass with respect to 100% by mass of the polymer; and
a solvent, wherein
the curing agent is at least one monomeric compound selected from the group consisting of polyfunctional (meth)acrylate compounds.

2. The thermosetting resin composition according to claim 1 , wherein the polymer has a structural unit of Formula (1a):

3. The thermosetting resin composition according to claim 1 , wherein the curing agent is a polyfunctional acrylate compound.

4. The thermosetting resin composition according to claim 1 , further comprising a surfactant.

5. The thermosetting resin composition according to claim 1 , wherein the curing agent is present in an amount of 1% by mass to 30% by mass with respect to the solid content of the composition.

6. The thermosetting resin composition according to claim 1 , wherein the curing agent is present in an amount of 1% by mass to 20% by mass with respect to the solid content of the composition.

7. The thermosetting resin composition according to claim 1 , wherein the curing agent is present in an amount of 1% by mass to 10% by mass with respect to the solid content of the composition.

8. A planarizing film comprising a thermosetting resin prepared from the thermosetting resin composition according to claim 1 .

9. A protective film comprising a thermosetting resin prepared from the thermosetting resin composition according to claim 1 .

10. A method for producing a cured film, a protective film, or a planarizing film, the method comprising:
applying the thermosetting resin composition as claimed in claim 1 onto a substrate; and
subsequently baking the thermosetting resin composition at a sufficient temperature to be cured.

Assignees

• Nissan Chemical Ind Ltd

Inventors

• Sakaguchi Takahiro
• Sugawara Yuki
• Adachi Isao

Classifications

• C09D163/10 Primary

  Epoxy resins modified by unsaturated compounds · CPC title

• C08F212/08 Primary

  Styrene · CPC title

• C08G63/6858

  Polycarboxylic acids and polyhydroxy compounds in which at least one of the two components contains aliphatic unsaturation · CPC title

• C08G59/1466

  Acrylic or methacrylic acids · CPC title

• C08G59/14

  Polycondensates modified by chemical after-treatment · CPC title