Curable resin composition and adhesive for bonding structural material using composition

Patent metadata

Field	Value
Publication number	US-11208579-B2
Application number	US-201716319352-A
Country	US
Kind code	B2
Filing date	Jun 13, 2017
Priority date	Jul 29, 2016
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.

First claim

The invention claimed is:

1. A curable resin composition comprising:
(A1) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin; and
(A2) an epoxy resin excluding component (A1);
(B) a blocked urethane, which is a compound obtained by further reacting a blocking agent (b4) with a polyurethane resin (b3) obtained by reacting a polyol (b1) and a polyisocyanate (b2), wherein the blocking agent (b4) is at least one compound selected from the group consisting of active methylene compounds, oxime compounds, monohydric alcohols, glycol derivatives, amine compounds, phenols and ε-caprolactams; and
(C) a latent curing agent, wherein the latent curing agent (C) is at least one compound selected from the group consisting of dicyandiamide, hydrazides, 4,4′-diaminodiphenylsulfone, boron trifluoride amine complex salt and ureas,
wherein a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.

2. The curable resin composition according to claim 1 ,
wherein the epoxy compound (a2) is a bisphenol epoxy resin.

3. An adhesive for bonding a structural material, which uses the curable resin composition according to claim 1 .

4. The adhesive for bonding a structural material according to claim 3 , which is used for bonding aluminum materials.

Assignees

• Adeka Corp

Inventors

• Ide Mitsunori
• Ota Keisuke
• Nagamatsu Tamotsu

Classifications

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/3272

  containing phosphorus · CPC title

• C09J175/04

  Polyurethanes · CPC title

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C08G18/58 Primary

  Epoxy resins {(C08G18/42, C08G18/48 take precedence; reaction products of epoxy resins with at least equivalent amounts of compounds containing active hydrogen C08G18/6407, with at least equivalent amounts of amines C08G18/6415; polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen C08G18/003)} · CPC title