Resin sheet and cured product of resin sheet

Patent metadata

Field	Value
Publication number	US-10988585-B2
Application number	US-201616079739-A
Country	US
Kind code	B2
Filing date	Aug 25, 2016
Priority date	Feb 25, 2016
Publication date	Apr 27, 2021
Grant date	Apr 27, 2021

Abstract

A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

First claim

What is claimed is:

1. A resin sheet comprising:
an epoxy resin comprising an epoxy resin oligomer and an epoxy resin monomer, wherein the epoxy resin oligomer has a number average molecular weight of from 600 to 2,300;
a curing agent; and
an inorganic filler,
wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

2. The resin sheet according to claim 1 , wherein the epoxy resin oligomer comprises a reaction product of an epoxy resin monomer having a mesogen skeleton, with a divalent phenolic compound having a structure in which two hydroxyl groups are bound to one benzene ring.

3. The resin sheet according to claim 1 , wherein the epoxy resin oligomer comprises a reaction product of a compound represented by the following Formula (1), with a divalent phenolic compound having a structure in which two hydroxyl groups are bound to one benzene ring:

wherein, in Formula (1), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.

4. The resin sheet according to claim 2 , wherein the divalent phenolic compound comprises hydroquinone.

5. The resin sheet according to claim 1 , wherein the epoxy resin monomer comprises a compound comprising a mesogen skeleton and two epoxy groups in a molecule thereof.

6. The resin sheet according to claim 1 , wherein the epoxy resin monomer comprises at least one selected from the group consisting of a compound represented by the following Formula (1) and a biphenyl-type epoxy resin monomer:

wherein, in Formula (1), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.

7. The resin sheet according to claim 1 , wherein the curing agent comprises a dihydroxybenzene novolac resin.

8. The resin sheet according to claim 1 , wherein the resin sheet has an average thickness of from 0.2 mm to 3 mm.

9. A cured product of a resin sheet, which is a cured product of the resin sheet according to claim 1 .

10. The cured product of the resin sheet according to claim 9 , having a diffraction peak in a diffraction angle 2θ range of from 3.0° to 3.5° according to an X-ray diffraction method using CuKα radiation.

Assignees

• Hitachi Chemical Co Ltd
• Showa Denko Materials Co Ltd

Inventors

• Nishiyama Tomoo
• Takezawa Yoshitaka
• Katagi Hideyuki
• Kiguchi Kazuya

Classifications

• C08G59/14 Primary

  Polycondensates modified by chemical after-treatment · CPC title

• C08K2003/385

  Binary compounds of nitrogen with boron · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/24

  carbocyclic · CPC title

• C08G59/1438

  containing oxygen · CPC title