Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
US-2024376243-A1 · Nov 14, 2024 · US
Imides, e.g. cyclic imides
Imides, e.g. cyclic imides · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08F22/40 |
| Official title | Imides, e.g. cyclic imides |
| Display label | Imides, e.g. cyclic imides |
| Total patents | 87 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 7 |
| 2017 | 4 |
| 2018 | 6 |
| 2019 | 4 |
| 2020 | 11 |
| 2021 | 4 |
| 2022 | 13 |
| 2023 | 7 |
| 2024 | 12 |
| 2025 | 11 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Composition containing organic semiconductor, solution for forming organic semiconductor layer, organic semiconductor layer, and organic thin film transistor
US-12101991-B2 · Sep 24, 2024 · US
BCDA-based semi-alicyclic homo- or co-polyimide membrane materials for gas separation and the preparation method thereof
US-11851559-B2 · Dec 26, 2023 · US
Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
US-2023323104-A1 · Oct 12, 2023 · US
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
US-2023257581-A1 · Aug 17, 2023 · US
Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film
US-11692066-B2 · Jul 4, 2023 · US
Solvent composition and production method therefor
US-11629237-B2 · Apr 18, 2023 · US
Resin particles, electrically conductive particles, electrically conductive material, and connection structure
US-2023106977-A1 · Apr 6, 2023 · US
Curable composition
US-2023054785-A1 · Feb 23, 2023 · US
Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device
US-2022389130-A1 · Dec 8, 2022 · US
Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film
US-11500292-B2 · Nov 15, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-11466123-B2 · Oct 11, 2022 · US
Bismaleimide Compound, Composition Containing Same, Polybenzoxazole, And Semiconductor Device
US-2022298281-A1 · Sep 22, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-11447658-B2 · Sep 20, 2022 · US
Curable composition for making cured layer with high thermal stability
US-11434313-B2 · Sep 6, 2022 · US
Maleimide, curable resin composition, and cured product
US-2022251254-A1 · Aug 11, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2022204695-A1 · Jun 30, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2022204810-A1 · Jun 30, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-11370857-B2 · Jun 28, 2022 · US
Curable composition for making cured layer with high thermal stability
US-2022185915-A1 · Jun 16, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08F22/40?
- CPC C08F22/40 is the Cooperative Patent Classification code for “Imides, e.g. cyclic imides.”
- How many patents are filed under CPC C08F22/40 (Imides, e.g. cyclic imides)?
- Our database includes 87 publications tagged with this CPC code.
- Is patent activity under CPC C08F22/40 growing?
- Publication counts under this code: 12 in 2024 vs 11 in 2025 (latest complete years).