Curable composition for making cured layer with high thermal stability

US11434313B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11434313-B2
Application numberUS-202017124063-A
CountryUS
Kind codeB2
Filing dateDec 16, 2020
Priority dateDec 16, 2020
Publication dateSep 6, 2022
Grant dateSep 6, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa·s, and a cured layer of the curable composition can have a high thermal stability up to 350° C.

First claim

Opening claim text (preview).

What is claimed is: 1. A curable composition, comprising a polymerizable material and a photoinitiator, wherein the polymerizable material comprising a first monomer including at least one bismaleimide-monomer and at least one second monomer, wherein the bismaleimide monomer is dissolved within the second monomer; an amount of the at least one bismaleimide-monomer is at least 5 wt % and not greater than 60 wt % based on the total weight of the polymerizable material; a viscosity of the curable composition at 23° C. is not greater than 30 mPa·s; and a cured layer of the curable composition after being subjected to a baking treatment at 350° C. for 30 minutes under nitrogen has a weight loss during a reheating under nitrogen from 25° C. to 350° C. at a rate of 20° C./min of not greater than 2%. 2. The curable composition of claim 1 , wherein the amount of the at least one bismaleimide-monomer is at least 5 wt % and not greater than 30 wt %. 3. The curable composition of claim 2 , wherein the amount of the bismaleimide-monomer is at least 5 wt % and not greater than 15 wt %. 4. The curable composition of claim 1 , wherein the at least one second monomer includes at least one acrylate monomer, divinylbenzene (DVB), N-vinylpyrrolidone (NVP), acryloylmorpholine (AMP), or any combination thereof. 5. The curable composition of claim 4 , wherein the at least one acrylate monomer includes at least one multi-functional acrylate monomer (MFA). 6. The curable composition of claim 4 , wherein the second monomer comprises DVB and at least one multi-functional acrylate monomer. 7. The curable composition of claim 4 , wherein the acrylate monomer comprises a mono-functional acrylate monomer, wherein an amount of the mono-functional acrylate monomer is not greater than 20 wt % based on the total weight of the polymerizable material. 8. The curable composition of claim 1 , wherein the at least one bismaleimide monomer includes 4,4′-bismaleimidodiphenylmethane; bis(3-ethyl-5-methyl-4-maleimidophenyl)methane; 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane or any combination thereof. 9. The curable composition of claim 1 , wherein the curable composition is essentially free of a solvent. 10. The curable composition of claim 1 , wherein the bismaleimide monomer is a solid at room temperature and dissolved in N-vinylpyrrolidone (NVP) or acryloylmorpholine (AMP). 11. The curable composition of claim 1 , wherein the bismaleimide monomer is a fluid at room temperature and the second monomer comprises DVB, or a multi-functional acrylate monomer, or a combination thereof. 12. A laminate comprising a substrate and a cured layer overlying the substrate, wherein the cured layer is formed from the curable composition of claim 1 . 13. The laminate of claim 12 , wherein the weight loss of the cured layer during the reheating from 25° C. to 350° C. under nitrogen at a speed of 20° C./minute is not greater than 1.5%. 14. A method of forming a cured layer on a substrate, comprising: applying a layer of a curable composition on the substrate, wherein the curable composition comprises a polymerizable material and a photoinitiator, the polymerizable material comprising a first monomer including at least one bismaleimide-monomer and a second monomer, wherein the bismaleimide monomer is dissolved within the second monomer and an amount of the at least one bismaleimide-monomer is at least 5 wt % and not greater than 60 wt % based on the total weight of the polymerizable material; bringing the curable composition into contact with a superstrate; irradiating the curable composition with light to form a cured layer; and removing the superstrate from the cured layer, wherein the cured layer after being after being subjected to a baking treatment at 350° C. for 30 minutes under nitrogen has a weight loss during a reheating under nitrogen from 25° C. to 350° C. at a rate of 20° C./min of not greater than 2%. 15. The method of claim 14 , wherein a viscosity of the curable composition at 23° C. is not greater than 30 mPa·s. 16. The method of claim 14 , wherein the second monomer includes at least one acrylate monomer, divinylbenzene (DVB), trivinylbenzene (TVB, N-vinylpyrrolidone (NVP), acryloylmorpholine (AMP), or any combination thereof. 17. The method of claim 16 , wherein the acrylate monomer comprises at least one multi-functional acrylate monomer. 18. The method of claim 14 , wherein the at least one bismaleimide monomer includes 4,4′-bismaleimidodiphenylmethane; bis(3-ethyl-5-methyl-4-maleimidophenyl)methane; 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane or any combination thereof. 19. A method of manufacturing an article, comprising: applying a layer of a curable composition on a substrate, wherein the curable composition comprises a polymerizable material and a photoinitiator, the polymerizable material comprising a first monomer including at least one bismaleimide-monomer and a second monomer, wherein the bismaleimide monomer is dissolved within the second monomer and an amount of the at least one bismaleimide-monomer is at least 5 wt % and not greater than 60 wt % based on the total weight of the polymerizable material; bringing the curable composition into contact with a superstrate; irradiating the curable composition with light to form a cured layer; removing the superstrate from the cured layer, wherein the cured layer after being subjected to a baking treatment at 350° C. for 30 minutes under nitrogen has a weight loss during a reheating under nitrogen from 25° C. to 350° C. at a rate of 20° C./min of not greater than 2%; forming a pattern on the substrate; processing the substrate on which the pattern has been formed in the forming; and manufacturing an article from the substrate processed in the processing.

Assignees

Inventors

Classifications

  • Imides, e.g. cyclic imides · CPC title

  • Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16} · CPC title

  • comprising polyimides · CPC title

  • N-Vinyl-pyrrolidone · CPC title

  • Homopolymers or copolymers of hydrocarbons · CPC title

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Frequently asked questions

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What does patent US11434313B2 cover?
A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa·s, and a cured layer of the curable composition can have a high thermal stability up to 350° C.
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification B05D3/067. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).