Resin particles, electrically conductive particles, electrically conductive material, and connection structure

Patent metadata

Field	Value
Publication number	US-2023106977-A1
Application number	US-202117911505-A
Country	US
Kind code	A1
Filing date	Mar 26, 2021
Priority date	Mar 26, 2020
Publication date	Apr 6, 2023
Grant date	—

Abstract

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm2 or more and 2,500 N/mm2 or less, and a 30% K value at 25° C. of 100 N/mm2 or more and 1,500 N/mm2 or less.

First claim

1 . Resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm 2 or more and 2,500 N/mm 2 or less, and a 30% K value at 25° C. of 100 N/mm 2 or more and 1,500 N/mm 2 or less.

2 . The resin particles according to claim 1 , having a coefficient of variation of an aspect ratio of 10% or less.

3 . The resin particles according to claim 1 , having an average particle size of 0.1 μm or greater and 1,000 μm or smaller.

4 . The resin particles according to claim 1 , having a coefficient of variation of a particle size of 20% or less as determined by particle size distribution measurement.

5 . The resin particles according to claim 1 ,
wherein a change in the 30% K value before and after heating at 200° C. for 24 hours is 200% or less.

6 . The resin particles according to claim 1 , comprising a backbone containing an imide group.

7 . Conductive particles, comprising:
the resin particles according to claim 1 ; and a conductive layer formed on a surface of each of the resin particles.

8 . The conductive particles according to claim 7 ,
wherein an insulating material is provided on an outer surface of the conductive layer.

9 . The conductive particles according to claim 7 ,
wherein a protrusion is provided on the outer surface of the conductive layer.

10 . A conductive material comprising:
the conductive particles according to claim 7 ; and a binder resin.

11 . A connection structure comprising:
a first connection target member that has a first electrode on a surface thereof; a second connection target member that has a second electrode on a surface thereof and a connecting portion connecting the first connection target member and the second connection target member, the connecting portion including, as a constituting material, the conductive particles according to claim 7 .

Assignees

• Sekisui Chemical Co Ltd

Inventors

• Ookura Kouki
• Wakiya Takeshi

Classifications

• H10W72/354

  comprising polymers · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• C23C18/1641

  Organic substrates, e.g. resin, plastic · CPC title

• C23C18/34

  using reducing agents · CPC title