Solvent composition and production method therefor

Patent metadata

Field	Value
Publication number	US-11629237-B2
Application number	US-201916688209-A
Country	US
Kind code	B2
Filing date	Nov 19, 2019
Priority date	May 19, 2017
Publication date	Apr 18, 2023
Grant date	Apr 18, 2023

Abstract

A solvent composition includes an organic solvent including one or more organic solvents (A) and one or more organic solvents (B), and one or more types of core-shell polymer particles each comprising a core layer and a shell layer. The organic sol vents (A) have a polar teen δp of a Hansen solubility parameter of less than 11 and a hydrogen bond term δh of less than 10, and the organic solvents (B) satisfy at least one of 11 or more of the polar term δp or 10 or more of the hydrogen bond term δh. A weight ratio of (A) to (B) ranges from 15:85 to 95:5. Based on a total weight of the solvent composition, a content of the core-shell polymer particles is 20 to 40% by weight and a water content is 1% by weight or less.

First claim

What is claimed is:

1. A solvent composition comprising:
an organic solvent comprising one or more organic solvents (A) and one or more organic solvents (B); and
one or more types of core-shell polymer particles each comprising a core layer and a shell layer 1, wherein the core layer of the core-shell polymer particles includes:
(i) a rubber elastic body formed from 50 to 100% by weight of one or more monomers selected from the group consisting of diene monomers and (meth)acrylic ester monomer and less than 50% by weight of other copolymerizable vinyl monomer,
(ii) a polysiloxane rubber-based elastic body,
(iii) an aromatic vinyl crosslinked body, or
(iv) a mixture of two of more of (i) to (iii), and

wherein the other copolymerizable vinyl monomer is one or more selected from the group consisting of an aromatic vinyl compound, a vinyl cyanide compound, an unsaturated carboxylic acid derivative, a (meth)acrylic acid amide derivative, and a maleimide derivative,
wherein the one or more organic solvents (A) have a polar term δp of a Hansen solubility parameter of less than 11 and a hydrogen bond term δh of less than 10,
wherein the one or more organic solvents (B) satisfy at least one of: 11 or more of the polar δp; or 10 or more of the hydrogen bond term δh,
wherein a weight ratio of the one or more organic solvents (A) to the one or more organic solvents (B) ranges from 15:85 to 95:5, and
wherein, based on a total weight of the solvent composition, a content of the core-shell polymer particles is 20 to 40% by weight and a water content is 1% by weight or less.

2. The solvent composition according to claim 1 , wherein the organic solvent (A) is one or more
solvents selected from the group consisting of toluene, xylene, ethyl acetate, propylene glucol monomethyl ether acetate, acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, and
the organic solvent (B) is one or more solvents selected from the group consisting of butanol, methyl cellosolve, butyl cellosolve, propylene glycol monomethyl ether, dimethylformamide, dimethyl acetamides, dimethyl sulfoxide, and N-methyl-2-pyrrolidone.

3. The solvent composition according to claim 1 , wherein the core-shell polymer particles in the solvent composition have a volume average particle size of 10 nm to 500 nm.

4. The solvent composition according to claim 1 , wherein 30% by weight or more of the core-shell polymer particles is formed of styrene.

5. The solvent composition according to claim 1 , wherein the core-shell polymer particles are copolymerized with 0.2 to 7 by weight of a crosslinkable monomer in 100% by weight of the core-shell polymer particles.

6. A varnish comprising a resin and the solvent composition according to claim 1 .

7. A method for producing a prepreg, the method comprising:
mixing a resin with the solvent composition according to claim 1 ;
impregnating a fiber with a composition containing the resin and the core-shell polymer particles; and
semi-curing the resin.

8. A method for producing a copper-clad laminated plate, the method comprising:
mixing a resin with the solvent composition according to claim 1 ;
impregnating a fiber with a composition containing the resin and the core-shell polymer particles;
semi-curing the resin to obtain a prepreg; and
laminating the prepreg and a copper foil and caring the prepreg.

9. A method for producing a printed wiring board, the method comprising:
mixing a resin with the solvent composition according to claim 1 ;
impregnating a fiber with a composition containing the resin and the core-shell polymer particles;
semi-curing the resin to obtain a prepreg;
laminating the prepreg and a copper foil and curing the prepreg to obtain a copper-clad laminated plate; and
forming a circuit on the copper-clad laminated plate.

10. A method for producing a solvent composition according to claim 1 , the method comprising:
mixing an aqueous medium dispersion containing core-shell polymer particles dispersed in an aqueous medium with one or more organic solvents (A) having a polar term δp of a Hansen solubility parameter of less than 11 and a hydrogen bond term δh of less than 10;
mixing a mixture of the aqueous medium dispersion and the organic solvent with water to obtain a particle loose aggregate;
separating and collecting the particle loose aggregate from a liquid phase;
mixing one or more organic solvents (A) having a polar term δp of a Hansen solubility parameter of less than 11 and a hydrogen bond term δh of less than 10 with the particle loos aggregate to obtain a particle dispersion;
mixing the particle dispersion with one or more organic solvents (B) satisfying at least one of: 11 or more of the polar term δp; or 10 or more of the hydrogen bond term δh; and
evaporating one or more substances selected from the group consisting of the organic solvent (A), the organic solvent (B), and water in the obtained mixture, wherein the organic solvent (A) and the organic solvent (B) are contained in a weight ratio of 15:85 to 95:5, and a content of the core-shell polymer particles is 20 to 40% by weight based on a total weight of the solvent composition.

11. A method for producing a varnish, the method comprising producing a solvent composition by the method according to claim 10 and then mixing a resin and the solvent composition.

12. A method for producing a resin composition, the method comprising producing a varnish by the method according to claim 11 and then evaporating the organic solvent (A) and/or the organic solvent (B) from the varnish.

13. The solvent composition according to claim 1 , wherein a total content of the organic solvent is 60 to 80% by weight based on the total weight of the solvent composition.

14. The solvent composition according to claim 1 , wherein a polymer constituting the shell layer of the core-shell polymer particles is a (co)polymer obtained by polymerizing one or more selected from (meth)acrylic ester monomers, aromatic vinyl monomers, vinyl cyanide monomers, unsaturated carboxylic acid derivatives, (meth)acrylamide.

Assignees

• Kaneka Corp

Inventors

• Yoshihara Shusuke

Classifications

• C08L83/04

  Polysiloxanes · CPC title

• C08F257/02

  on to polymers of styrene or alkyl-substituted styrenes · CPC title

• C08K5/00

  Use of organic ingredients · CPC title

• C08L101/00

  Compositions of unspecified macromolecular compounds · CPC title

• C08L51/00

  Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds (for ABS polymers C08L55/02); Compositions of derivatives of such polymers · CPC title