Method of manufacturing microchannel chip
US-2020094249-A1 · Mar 26, 2020 · US
Assembling of devices or systems from individually processed components
Assembling of devices or systems from individually processed components · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C3/00 |
| Official title | Assembling of devices or systems from individually processed components |
| Display label | Assembling of devices or systems from individually processed components |
| Total patents | 96 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 11 |
| 2017 | 8 |
| 2018 | 11 |
| 2019 | 10 |
| 2020 | 8 |
| 2021 | 4 |
| 2022 | 8 |
| 2023 | 6 |
| 2024 | 8 |
| 2025 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Mirror drive device and method for producing same
US-10549981-B2 · Feb 4, 2020 · US
Physical quantity sensor and manufacturing method therefor
US-10509051-B2 · Dec 17, 2019 · US
Inertia sensor and method of manufacturing the same
US-10502758-B2 · Dec 10, 2019 · US
Top port multi-part surface mount silicon condenser microphone
US-10477301-B2 · Nov 12, 2019 · US
Microreactor, chemical product manufacturing system and microreactor manufacturing method
US-10464039-B2 · Nov 5, 2019 · US
Fingerprint sensor and manufacturing method thereof
US-10446455-B2 · Oct 15, 2019 · US
Top port multi-part surface mount silicon condenser microphone
US-2019253791-A1 · Aug 15, 2019 · US
Top port multi-part surface mount MEMS microphone
US-10321226-B2 · Jun 11, 2019 · US
Fingerprint sensor and manufacturing method thereof
US-10297515-B2 · May 21, 2019 · US
Microreactor, chemical product manufacturing system and microreactor manufacturing method
US-2019118156-A1 · Apr 25, 2019 · US
Electrode Integration Into Organs On Chip Devices
US-2019025240-A1 · Jan 24, 2019 · US
Package production method and package produced by the method
US-10125015-B2 · Nov 13, 2018 · US
Top port multi-part surface mount silicon condenser microphone package
US-2018249242-A1 · Aug 30, 2018 · US
Inertia sensor and method of manufacturing the same
US-2018238926-A1 · Aug 23, 2018 · US
Mirror drive device and method for producing same
US-2018148314-A1 · May 31, 2018 · US
Top port multi-part surface mount silicon condenser microphone
US-9980038-B2 · May 22, 2018 · US
Packaged microsystems
US-9950922-B2 · Apr 24, 2018 · US
System and method for a packaged MEMS device
US-9952111-B2 · Apr 24, 2018 · US
Physical quantity sensor and manufacturing method therefor
US-2018095106-A1 · Apr 5, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C3/00?
- CPC B81C3/00 is the Cooperative Patent Classification code for “Assembling of devices or systems from individually processed components.”
- How many patents are filed under CPC B81C3/00 (Assembling of devices or systems from individually processed components)?
- Our database includes 96 publications tagged with this CPC code.
- Is patent activity under CPC B81C3/00 growing?
- Publication counts under this code: 8 in 2024 vs 4 in 2025 (latest complete years).