Fingerprint sensor and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10446455-B2
Application number	US-201715591416-A
Country	US
Kind code	B2
Filing date	May 10, 2017
Priority date	May 12, 2015
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.

First claim

What is claimed is:

1. A fingerprint sensor device comprising:
a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides;
a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the semiconductor die operates to sense a fingerprint of a finger positioned above the top die side;
a plurality of conductive interconnection structures electrically connecting the bottom die side to the top substrate side; and
a unitary encapsulant surrounding at least the lateral die sides and covering at least a portion of the top substrate side, wherein no portion of the encapsulant is higher than the top die side, and wherein no portion of the bottom substrate side is covered by the unitary encapsulant.

2. The fingerprint sensor device of claim 1 , wherein no portions of the lateral substrate sides are covered by the unitary encapsulant.

3. The fingerprint sensor device of claim 1 , wherein the entire top side of the encapsulant that is laterally outside of a perimeter of the semiconductor die is in a single plane.

4. The fingerprint sensor device of claim 1 , comprising a protective layer that directly contacts and covers at least a portion of the top die side, wherein the protective layer comprises only a single layer of a single material, and said at least a portion of the top die side is covered by no material other than the protective layer.

5. The fingerprint sensor device of claim 1 , comprising a protective layer of a single material that directly contacts and covers the top die side and at least a portion of the top side of the encapsulant, and wherein the protective layer comprises a polymer coating.

6. The fingerprint sensor device of claim 1 , wherein the encapsulant is exposed at the top side of the fingerprint sensor device.

7. The fingerprint sensor device of claim 6 , wherein the bottom die side comprises bottom side electrical circuitry that comprises a fingerprint sensing unit.

8. The fingerprint sensor device of claim 1 , wherein the fingerprint sensor device comprises a fingerprint sensor package, and comprising a conductive interconnect at the bottom substrate side and accessible at a bottom side of the fingerprint sensor package.

9. The fingerprint sensor device of claim 1 , wherein the encapsulant is a molded encapsulant.

10. A method of manufacturing a fingerprint sensor device, the method comprising:
providing a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides;
providing a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the semiconductor die operates to sense a fingerprint of a finger positioned above the top die side;
connecting the bottom die side to the top substrate side utilizing a plurality of conductive interconnection structures; and
forming a unitary encapsulant surrounding at least the lateral die sides and covering at least a portion of the top substrate side, wherein no portion of the encapsulant is higher than the top die side, and wherein no portion of the bottom substrate side is covered by the unitary encapsulant.

11. The method of claim 10 , wherein no portion of the lateral substrate sides is covered by the unitary encapsulant.

12. The method of claim 10 , wherein said forming the encapsulant comprises forming the encapsulant such that the entire top side of the encapsulant around a perimeter of the semiconductor die is in a single plane.

13. The method of claim 10 , comprising forming a protective layer that directly contacts and covers at least a portion of the top die side.

14. The method of claim 13 , wherein the protective layer comprises only a single layer of a single material, and said at least a portion of the top die side is covered by no material other than the protective layer.

Assignees

• Amkor Technology Inc

Inventors

• Park Sung Sun
• Chung Ji Young
• Berry Christopher

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• G06V40/13

  Sensors therefor · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title