Top port multi-part surface mount silicon condenser microphone

Patent metadata

Field	Value
Publication number	US-10477301-B2
Application number	US-201916392546-A
Country	US
Kind code	B2
Filing date	Apr 23, 2019
Priority date	Nov 28, 2000
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

First claim

What is claimed is:

1. An acoustic device comprising:
a substantially planar support member comprising:
a rigid top layer comprising:
a first non-conductive laminate material layer;
a first conductive layer disposed on an upper surface of the first laminate material layer; and
a mounting region disposed along a periphery of an upper surface of the top layer,
wherein the first conductive layer is patterned to form a first electrical interface comprising a plurality of electrically-conductive pads;

a rigid bottom layer comprising:
a second non-conductive laminate material layer; and
a second conductive layer disposed on a lower surface of the second laminate material layer,
wherein the second conductive layer is pattered to form a second electrical interface comprising a plurality of electrically-conductive flat solder pads that are substantially flush with the lower surface of the second laminate material layer, and
wherein the second electrical interface enables reflow solder attachment of the acoustic device; and

a plurality of electrical vias within the support member that electrically couple the plurality of conductive pads of the first electrical interface to the plurality of conductive flat solder pads of the second electrical interface;

a micro-electro-mechanical system (MEMS) microphone die mounted to the top layer of the support member and electrically coupled to at least one of the conductive pads of the first electrical interface; and
a single-piece shield member that includes an acoustic port,
wherein the shield member is a rectangular box-shaped shell of solid material with one open side, the shield member having sidewall portions with a predetermined height to space a top portion of the shield member from the upper surface of the top layer of the support member, the sidewall portions having an attachment surface, the acoustic port disposed in the top portion of the shield member and passing completely through the shield member,
wherein the attachment surface of the sidewall portions of the shield member is aligned with and attached to the mounting region of the support member, and
wherein the open side of the shield member enables the shield member, in cooperation with the upper surface of the top layer of the support member, to form a protective enclosure for the MEMS microphone die to reduce electromagnetic interference.

2. The acoustic device of claim 1 , wherein the MEMS microphone die is a pressure-equalizing MEMS microphone die, and wherein a diaphragm of the MEMS microphone die defines a front volume and a back volume within the protective enclosure, and the acoustic port of the shield member is acoustically coupled to the diaphragm.

3. The acoustic device of claim 2 , wherein an interface between the attachment surface of the sidewall portions of the shield member and the upper surface of the top layer of the support member is sealed to maintain acoustic pressure within the front volume.

4. The acoustic device of claim 2 , wherein the support member further comprises a recess located in the top layer, and the MEMS microphone die is positioned over the recess.

5. The acoustic device of claim 2 , wherein the support member further comprises an internal cavity with an aperture in the upper surface of the top layer, the internal cavity extending longitudinally within the support member, and the MEMS microphone die is positioned over the aperture in the upper surface of the top layer of the support member.

6. The acoustic device of claim 1 , wherein the first and second laminate material layers comprise one or more layers of FR-4 printed circuit board material.

7. The acoustic device of claim 1 , wherein the support member further comprises:
a third conductive layer disposed on a lower surface of the first laminate material layer, wherein the third conductive layer is patterned to form a plurality of first electrodes, the first electrodes being electrically coupled to the first electrical interface by electrical vias;
a fourth conductive layer disposed on an upper surface of the second laminate material layer, wherein the fourth conductive layer is patterned to form a plurality of second electrodes, the second electrodes being electrically coupled to the second electrical interface by electrical vias; and
a passive electronic material layer disposed between the third and fourth conductive layers and in electrical contact with the first and second electrodes.

8. The acoustic device of claim 7 , wherein the passive electronic material layer is a resistive material.

9. The acoustic device of claim 7 , wherein the passive electronic material layer is a capacitive dielectric material.

10. The acoustic device of claim 7 , wherein a passive electrical element formed in the passive electronic material layer filters one or more of an input signal, an output signal, or input power.

11. An acoustic device comprising:
a substantially planar support member comprising:
a rigid top layer comprising:
a first non-conductive laminate material layer;
a first conductive layer disposed on an upper surface of the first laminate material layer; and
a mounting region disposed along a periphery of an upper surface of the top layer,
wherein the first conductive layer is patterned to form a first electrical interface comprising a plurality of electrically-conductive soldering pads;

a rigid bottom layer comprising:
a second non-conductive laminate material layer; and
a second conductive layer disposed on a lower surface of the second laminate material layer,
wherein the second conductive layer is pattered to form a second electrical interface comprising a plurality of electrically-conductive flat solder pads that are substantially flush with the lower surface of the second laminate material layer, and
wherein the second electrical interface enables reflow solder attachment of the acoustic device; and

a plurality of electrical vias within the support member that electrically couple the plurality of conductive pads of the first interface to the plurality of conductive flat solder pads of the second electrical interface; and
an acoustic port disposed in an interior region of the support member and passing completely through the support member, wherein one of the plurality of flat solder pads of the second electrical interface is a metal ring that completely surrounds the acoustic port in the support member; and

a micro-electro-mechanical system (MEMS) microphone die mounted to the upper surface of the top layer of the support member and electrically coupled to at least one of the conductive pads of the first electrical interface, the MEMS microphone die being disposed directly over the acoustic port in the support member; and
a single-piece shield member,
wherein the shield member is a rectangular box-shaped shell of solid material with one open side, the shield member having sidewall portions with a predetermined height to space a top portion of the shield member from the upper surface of the top layer of the support member, the sidewall portions having an attachment surface,
wherein the attachment surface of the sidewall portions of the shield member is aligned with and attached to the mounting region of the support member, and
wherein the open side of the shield member enables the shield member, in cooperation with the upper surface of the top layer of the support member, to form a protective enclosure for the MEMS microphone die to reduce electromagnetic interference.

12. The acoustic device of claim 11 , wherein the support member further comprises:
a third conductive layer disposed on a lower surface of the first laminate material

Assignees

• Knowles Electronics Llc

Inventors

• Minervini Anthony D

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W76/60

  Seals · CPC title

• H10W70/692

  Ceramics or glasses · CPC title

• H04R1/04

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

• B81B2201/0257

  Microphones or microspeakers · CPC title