Prepreg, metal-clad laminated plate and printed wiring board
US-2016366761-A1 · Dec 15, 2016 · US
comprising epoxy resins
comprising epoxy resins · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B32B15/092 |
| Official title | comprising epoxy resins |
| Display label | comprising epoxy resins |
| Total patents | 811 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 34 |
| 2016 | 30 |
| 2017 | 70 |
| 2018 | 107 |
| 2019 | 100 |
| 2020 | 109 |
| 2021 | 93 |
| 2022 | 75 |
| 2023 | 80 |
| 2024 | 55 |
| 2025 | 48 |
| 2026 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board
US-2016345433-A1 · Nov 24, 2016 · US
Resin composition, prepreg, and laminate
US-9480164-B2 · Oct 25, 2016 · US
Electrically conductive film
US-9468092-B2 · Oct 11, 2016 · US
Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate
US-2016293538-A1 · Oct 6, 2016 · US
Resin composition and film using same
US-2016264813-A1 · Sep 15, 2016 · US
Barrier films and quantum dot polymer composite articles including the same
US-2016264820-A1 · Sep 15, 2016 · US
Electorically conductive film
US-2016266668-A1 · Sep 15, 2016 · US
Panel with releasable core
US-9434135-B2 · Sep 6, 2016 · US
Thermosetting resin sandwich prepreg, preparation method thereof and copper clad laminate therefrom
US-2016243798-A1 · Aug 25, 2016 · US
Surface treatment agent for metal material and production method for surface-treated metal material
US-2016244884-A1 · Aug 25, 2016 · US
Blank, in particular for permanently closing holes
US-2016200075-A1 · Jul 14, 2016 · US
Metal-clad laminate, method for producing same, and flexible printed board
US-9392689-B2 · Jul 12, 2016 · US
Self-fixturing metallic composite laminate
US-2016193811-A1 · Jul 7, 2016 · US
Electric Field Activated Shape Memory Polymer Composite
US-2016193810-A1 · Jul 7, 2016 · US
Laminate substrates having radial cut metallic planes
US-2016163611-A1 · Jun 9, 2016 · US
Resin composition and laminate for printed circuit board comprising same
US-2016150644-A1 · May 26, 2016 · US
Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device
US-9349931-B2 · May 24, 2016 · US
Flexible metal laminate
US-2016136933-A1 · May 19, 2016 · US
Resin composition, prepreg, resin sheet and metal foil-clad laminate
US-2016125972-A1 · May 5, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B32B15/092?
- CPC B32B15/092 is the Cooperative Patent Classification code for “comprising epoxy resins.”
- How many patents are filed under CPC B32B15/092 (comprising epoxy resins)?
- Our database includes 811 publications tagged with this CPC code.
- Is patent activity under CPC B32B15/092 growing?
- Publication counts under this code: 55 in 2024 vs 48 in 2025 (latest complete years).