Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device

Patent metadata

Field	Value
Publication number	US-9349931-B2
Application number	US-201214008486-A
Country	US
Kind code	B2
Filing date	Mar 28, 2012
Priority date	Mar 28, 2011
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 μm to less than 1 μm, from 1 μm to less than 10 μm, and from 10 μm to 100 μm, and the filler contains boron nitride particles having particle sizes of from 10 μm to 100 μm. In the general Formula (I), R 1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R 2 and R 3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.

First claim

The invention claimed is:

1. A resin composition comprising
an epoxy resin monomer,
a novolac resin containing a compound having a structural unit represented by general Formula (I), and
a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 μm to less than 1 μm, from 1 μm to less than 10 μm, and from 10 μm to 100 μm, and the filler having particle sizes of from 10 μm to 100 μm contains boron nitride particles;

wherein in the general Formula (I), R 1 represents an alkyl group, an aryl group, or an aralkyl group; each of R 2 and R 3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group; m represents a number from 0 to 2; and n represents a number from 1 to 7.

2. The resin composition according to claim 1 , wherein the novolac resin further contains a phenol compound constituting a novolac resin, and
a content ratio of the phenol compound is from 5% by mass to 50% by mass.

3. A resin sheet formed by molding the resin composition according to claim 1 into a sheet shape having an average thickness of from 80 μm to 250 μm.

4. The resin sheet according to claim 3 , wherein an arithmetic mean roughness of the surface of the resin sheet thereof is from 1.0 μm to 2.5 μm.

5. The resin sheet according to claim 3 , which is a laminate of a first resin layer and a second resin layer formed of the resin composition.

6. The resin sheet according to claim 5 , further having a metal foil on one surface of the laminate, and
further having a polyethylene terephthalate film on the other surface thereof.

7. A cured resin sheet which is a thermally treated material of the resin sheet according to claim 3 .

8. A resin sheet laminate including the resin sheet according to claim 3 , and a metal plate or a heat-dissipating plate disposed on at least one surface of the resin sheet.

9. A cured resin sheet laminate which is a thermally treated material of the resin sheet laminate according to claim 8 .

10. A semiconductor device comprising a semiconductor element, and the cured resin sheet according to claim 7 which is disposed on the semiconductor element.

11. An LED device in which an LED element, the cured resin sheet according to claim 7 and a substrate are laminated in this order.

12. A resin composition comprising
an epoxy resin monomer,
a novolac resin containing a compound having a structural unit represented by general Formula (I),
a first filler having a volume-average particle size of from 0.01 μm to less than 1 μm,
a second filler having a volume-average particle size of from 1 μm to less than 10 μm, and
a third filler having a volume-average particle size of from 10 μm to 100 μm and containing a boron nitride particle;

in which in the general Formula (I), R 1 represents an alkyl group, an aryl group, or an aralkyl group; each of R 2 and R 3 independently represents a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents a real number from 0 to 2; and n represents a real number from 1 to 7.

13. The resin composition according to claim 12 , wherein the first filler contains an aluminum oxide particle.

14. The resin composition according to claim 12 , wherein
a content of the first filler is from 1% by volume to 15% by volume,
a content of the second filler is from 10% by volume to 40% by volume, and
a content of the third filler is from 45% by volume to 80% by volume, based on a total volume of the first filler, the second filler and the third filler.

15. The resin composition according to claim 12 , wherein the novolac resin further contains a phenol compound constituting a novolac resin, and
a content ratio of the phenol compound is from 5% by mass to 50% by mass.

16. A resin sheet formed by molding the resin composition according to claim 13 into a sheet shape having an average thickness of from 80 μm to 250 μm.

17. The resin sheet according to claim 16 , wherein an arithmetic mean roughness of the surface thereof is from 1.0 μm to 2.5 μm.

18. The resin sheet according to claim 17 , which is a laminate of a first resin layer and a second resin layer formed of the resin composition.

19. The resin sheet according to claim 18 , further having a metal foil on one surface of the laminate, and
further having a polyethylene terephthalate film on the other surface thereof.

20. A cured resin sheet which is a thermally treated material of the resin sheet according to claim 16 .

21. A resin sheet laminate including the resin sheet according to claim 16 , and a metal plate or a heat-dissipating plate disposed on at least one surface of the resin sheet.

22. A cured resin sheet laminate which is a thermally treated material of the resin sheet laminate according to claim 21 .

23. A semiconductor device comprising a semiconductor element, and the cured resin sheet according to claim 20 which is disposed on the semiconductor element.

24. An LED device in which an LED element, the cured resin sheet according to claim 20 and a substrate are laminated in this order.

Assignees

• Nishiyama Tomoo
• Kuwano Atsushi
• Shirasaka Toshiaki
• Hara Naoki
• Yoshihara Kensuke
• Katagi Hideyuki
• Hitachi Chemical Co Ltd

Inventors

• Nishiyama Tomoo
• Kuwano Atsushi
• Shirasaka Toshiaki
• Hara Naoki
• Yoshihara Kensuke
• Katagi Hideyuki

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07555

  changes in materials · CPC title

• H10W72/5528

  Intermetallic compounds · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title