Thermosetting resin sandwich prepreg, preparation method thereof and copper clad laminate therefrom

Patent metadata

Field	Value
Publication number	US-2016243798-A1
Application number	US-201414378012-A
Country	US
Kind code	A1
Filing date	Jun 10, 2014
Priority date	May 27, 2014
Publication date	Aug 25, 2016
Grant date	—

Abstract

The present invention relates to a thermosetting resin sandwich prepreg, and the copper clad laminates and multi-layered printed circuit wiring boards manufactured therefrom. The interlayer of the thermosetting resin sandwich prepreg contains the thermosetting resin composition with a high content of fillers, and the outer layer of the prepreg contains the thermosetting resin composition with a low content of fillers. The copper clad laminates prepared by using the prepregs have good adhesion to metal foils, insulativity and uniform dielectric constant distribution.

First claim

1 . A thermosetting resin sandwich prepreg, comprising an interlayer and outer layers cladded on the both sides of the interlayer; the interlayer includes 20-80% by weight of a fillers, 20-70% by weight of a reinforcing material, 0-30% by weight of a thermosetting resin, based on the filler, the reinforcing material, and the thermosetting resin totaling 100% by weight; the outer layer includes 0-20% by weight of a fillers and 20-80% by weight of a thermosetting resin, based on the fillers and the thermosetting resin totaling 100% by weight.

2 . The sandwich prepreg according to claim 1 , wherein the fillers is one or more selected from crystalline silica, fused silica, spherical silica, aluminum hydroxide, calcium carbonate, strontium titanate, barium titanate, barium strontium titanate, boron nitride, aluminum nitride, silicon carbide, aluminum oxide, titanium dioxide, glass powder, glass chopped fiber, talc powder, mica powder, carbon black, carbon nanotube, graphene, metal powder, zinc molybdate, polyphenylene sulfide, and PTFE powder or combinations thereof; the moderate value of the particle size of the powder fillers is 0.01˜15 μm.

3 . The sandwich prepreg according to claim 2 , wherein the moderate value of the particle size of the powder filler is 0.5˜10 μm.

4 . The sandwich prepreg according to claim 1 , wherein the thickness of the outer layer of the prepreg is 1˜100 μm.

5 . The sandwich prepreg according to claim 4 , wherein the thickness of the outer layer of the prepreg is 5˜50 μm.

6 . The sandwich prepreg according to claim 1 , wherein the thermosetting resin includes: one or more selected from epoxy resin, cyanate resin, phenolic aldehyde resin, polyphenyl ether resin, polybutadiene resin, polybutadiene-styrene copolymer resin, polytetrafluoroethylene resin, polybenzoxazine resin, polyimide, silicon-containing resin, bismaleimide triazine resin (BT resin), LCP (Liquid Crystal Polymer) resin and bismaleimide resin.

7 . The sandwich prepreg according to claim 1 , wherein the reinforcing material fabric is E-type glass fiber fabric; or NE-type glass fiber fabric; Dk of a varnish solution prepared with a thermosetting resin and the filler corresponding to the interlayer using E-type glass fiber fabric is 6.0˜6.6; Dk of a varnish solution prepared with a thermosetting resin and the filler corresponding to the interlayer using NE-type glass fiber fabric is 4.4˜4.6.

8 . The sandwich prepreg according to claim 7 , wherein Dk of the filler in the interlayer using E-type glass fiber fabric is 6.0˜6.6, the filler is selected from E-glass powder; Dk of the filler in the interlayer using NE-type glass fiber fabric is 4.4˜4.6, the filler is selected from NE glass powder.

9 . A preparation method for manufacturing the sandwich prepreg according to claim 1 , comprising the following steps:
impregnating 20-70% by weight of the reinforcing material with the thermosetting resin varnish solution containing 20-80% by weight of the filler, 0-30% by weight of the thermosetting resin, based on the filler and the reinforcing material and the thermosetting resin totaling 100% by weight, and obtaining the prepreg; and further impregnating the prepreg obtained in step 1 with the thermosetting resin varnish solution containing a filler content of 0-30% based on the filler and the thermosetting resin totaling 100% by weight, and preparing the sandwich prepreg.

10 . The preparation method according to claim 9 , wherein the glass fiber fabric is E-type glass fiber fabric, Dk of the corresponding filler is 6.0˜6.6, the filler is selected from E-glass powder.

11 . The preparation method according to claim 10 , wherein the glass fiber fabric is NE-type glass fiber fabric, Dk of the corresponding filler is 4.4˜4.6, the filler is selected from NE glass powder.

12 . The preparation method according to claim 9 , wherein the sandwich prepreg is prepared by a vertical or horizontal type impregnation machine.

13 . A copper clad laminate manufactured with the sandwich prepreg according to claim 1 , further comprising: prepregs, and copper foils cladded on both sides of the prepregs; the prepreg includes the reinforcing material and the thermosetting resin composition adhered thereon by impregnation and drying.

14 . The copper clad laminate according to claim 13 , wherein the reinforcing material is an inorganic or organic material; the inorganic material is a machine-woven fabric or non-woven fabric or paper of a glass fiber, carbon fiber, boron fiber, or metal, in which the glass fiber fabric or non-woven fabric is E-glass, O-type fabric, NE fabric, D-type fabric, S-type fabric or high silica fabric; the organic material is a woven fabric or non-woven fabric or paper manufactured from polyesters, polyamines, poly acrylic acids, polyimides, aramid fiber, polytetrafluoroethylene, or syndiotactic polystyrenes; the metal foils are foils of copper, brass, aluminum, nickel, or alloys or composite metals of these metals; the thickness of the metal foils is 12-150 μm.

Assignees

• Shengyi Technology Co Ltd

Inventors

• Chai Songgang

Classifications

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B2260/046

  Synthetic resin · CPC title

• B32B27/38

  comprising epoxy resins · CPC title

• H05K2201/0129

  Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer · CPC title

• H05K1/0366 Primary

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title