Resin composition, prepreg, resin sheet and metal foil-clad laminate

Patent metadata

Field	Value
Publication number	US-2016125972-A1
Application number	US-201414893295-A
Country	US
Kind code	A1
Filing date	Jun 16, 2014
Priority date	Jun 18, 2013
Publication date	May 5, 2016
Grant date	—

Abstract

The resin composition of the present invention comprises a cyanate ester compound (A) obtained by cyanating a modified naphthalene formaldehyde resin, and an epoxy resin (B).

First claim

1 . A resin composition comprising:
a cyanate ester compound (A) obtained by cyanating a modified naphthalene formaldehyde resin; and an epoxy resin (B).

2 . The resin composition according to claim 1 , wherein a content of the cyanate ester compound (A) obtained by cyanating the modified naphthalene formaldehyde resin is 1 to 90 parts by mass when a content of a resin solid in the resin composition is 100 parts by mass.

3 . The resin composition according to claim 1 , further comprising an inorganic filler (C).

4 . The resin composition according to claim 1 , further comprising one or more selected from the group consisting of a maleimide compound, a phenolic resin, and a cyanate ester compound other than the cyanate ester compound (A) obtained by cyanating the modified naphthalene formaldehyde resin.

5 . The resin composition according to claim 1 , wherein the epoxy resin (B) is one or more selected from the group consisting of a biphenyl aralkyl-based epoxy resin, a naphthylene ether-based epoxy resin, a polyfunctional phenol-based epoxy resin, and a naphthalene-based epoxy resin.

6 . The resin composition according to claim 3 , wherein a content of the inorganic filler (C) is 50 to 1600 parts by mass when a content of a resin solid in the resin composition is 100 parts by mass.

7 . A prepreg obtained by impregnating or coating a base material with the resin composition according to claim 1 .

8 . A metal foil-clad laminate obtained by stacking at least one or more of the prepregs according to claim 7 , disposing metal foil on one surface or both surfaces of an obtained stack, and laminate-molding the metal foil and the stack.

9 . A resin composite sheet obtained by coating a surface of a support with the resin composition according to claim 1 and drying the resin composition.

10 . A printed wiring board comprising an insulating layer and a conductor layer formed on a surface of the insulating layer, wherein the insulating layer comprises the resin composition according to claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Arii Kenji
• Kobayashi Takashi
• Sogame Masanobu
• Mabuchi Yoshinori
• Mishima Hiroyuki

Classifications

• C08L79/04

  Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors · CPC title

• C09D161/18

  Condensation polymers of aldehydes or ketones with aromatic hydrocarbons or their halogen derivatives only · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title